The Global Interposer Technology 2015 Workshop (GIT 2015), sponsored by IEEE, is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass.
GIT 2015 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.
Session Topics Include:
- Interposer Design and Design Tools
- Glass Interposers
- Organic Interposers
- Fan-out Interposers
- Manufacturing Infrastructure
- Interposers for Heterogeneous Integration (high power, RF, MEMS, Bio, Analog and Sensors)
- Interconnections and Assembly
The Preliminary Program is now available.