3D Incites News - Page 8
NY CREATES and SEMI Sign Memorandum of Understanding to Advance Environmental Sustainability
Strategic Partnership Aims to Foster New Advancements in Sustainable Initiatives in the Semiconductor Industry SAN FRANCISCO — July 9, 2024...SEMI Americas Announces New Annual Event, SEMIEXPO In The Heartland, Focused on Smart Manufacturing and Smart Mobility
Event partners include the Indiana Economic Development Corporation, the Applied Research Institute, Purdue University, and Visit Indy SEMI announced its...
SEMICON West 2024 Opens July 9 in San Francisco
SEMICON West 2024 to Spotlight Investments in U.S. Semiconductor Manufacturing, AI, Key Trends and Industry Growth Concurrent with SEMICON West,...
Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography (MEBL) System for Volume Production
SkyWater Technology orders first MEBL system for rapid production of high-mix integrated circuits (ICs) and microdevices In a milestone for...
June Member News Highlights Semiconductor Design Tools, Collaborations, and More
This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing...
The Growing Importance of Glass Substrates in Semiconductor Technology
The semiconductor industry is experiencing a significant shift towards the use of glass substrates, driven by their superior performance characteristics...
Adeia Selects PulseForge Photonic Debonding Equipment for Advanced Semiconductor Applications
Adeia Inc. (Nasdaq: ADEA), a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry,...
PulseForge and Indium Corporation Present Joint Study on Optimizing Photonic Soldering Processes
PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented...
SEMI Foundation Launches Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+...
May Member News: Strategic Moves, Product Launches, Sustainability and more
May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product...
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
The Besi Datacon 8800 CHAMEO ultra plus advanced hybrid bonding system delivers faster throughput, enhanced accuracy, and superior warpage control for room temperature...
ERS electronic Releases Fully Automatic Luminex Machines with PhotoThermal Debonding and Wafer Cleaning
ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from...
Brewer Science Presents Low-temp Hybrid Bonding at ECTC 2024
Experience higher integration density and improved performance through hybrid bonding techniques. Denver, Colorado – May 23, 2024 – Brewer Science, Inc., a...
SEMICON Europa 2024 Call for Abstracts Opens
Presentation abstracts are now being accepted for the Advanced Packaging Conference, Fab Management Forum, and MEMS & Imaging Sensors Summit...
European Chip Skills Academy Launches Summer School in Italy to Promote Microelectronics Industry Careers
The European Chip Skills Academy (ECS Academy) Connects Students with Microelectronics Studies to Help Build Talent Pipeline University students will... Brewer Science Presents Innovative Material Solutions for Compound Semiconductor Manufacturing at CS Mantech
Brewer Science, a global technology leader in specialty materials for compound semiconductor manufacturing, invites attendees of CS Mantech to visit...
SEMI Releases Report on Maturity of Semiconductor Sector Corporate Climate Disclosures
MILPITAS, Calif. — May 8, 2024 — SEMI today released the report A Rising Tide: Building a Climate-Resilient Semiconductor Value Chain that spotlights...
LQDX Divests Aluminum Soldering Business – Mina™ – to Taiyo America Inc.
Focuses remaining business on Liquid Metal Inks for AI & High-Performance Computing LQDX (lick-QUID-ix), formerly known as Averatek Corp., developer...
