Carl McMahon, Author at 3D InCites

About Carl McMahon

Here are my most recent posts

Extending Moore’s Law through Advanced Packaging

Extending Moore’s Law through Advanced Packaging

The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form factor. There are concerns with the sustainab... »