Editor’s Note:
This July’s been a bit odd for me. In years past, I’d be feverishly editing all the podcast interviews I’d done at SEMICON West. But this year, West is in October… and people are taking summer vacations.. so things have been a bit quiet.
But then about a week ago, I heard from an old industry colleague, Doug Dixon, of 360 Circuits. Doug and I go way back to when he lead marcom at Henkel. In fact, one of my first ever roadshows at Advanced Packaging Magazine was to Henkel’s application lab. And it was there that I finally saw all the steps for advanced packaging performed.
Well it turns out that Doug has a hidden talent – he can take technical information and turn it into poetry. Literally. He sent me a fun example, and I begged him to let me share it on 3D InCites. Because it is poetry, it bears reading aloud. You can listen here.
~ Françoise
(A Seuss-ified Journey Through Hybrid Bonding)
By Doug Dixon
Congratulations!
Today is your day!
Your wafers are stacked in a 3D array.
You’ve etched all your vias, your pads are all prepped,
And your copper is planar, precisely adept.
You’re off to new nodes, you’re slicing those gates!
You’re building up layers at miraculous rates.
With hybrid bonding, oh what a delight,
You’ll link die-to-wafer with nanoscale might.
No bumps here, no glue here, no squishy goop mess!
Just copper-on-copper with dielectric finesse.
Align it just right (within one nanometer!),
Or your TSVs scream, “Call the yield team! It’s bleaker!”
You’ll pass through the plasma, the cleanest of rooms,
Where particles vanish with brushes and brooms.
Then clamp it, then press it, apply heat and force,
And bam! It’s a bond, like a champ on a course.
You’ll route with no wire, you’ll shrink all the pitch,
While old-school flip-chip just itches and twitches.
Your interconnect dreams will come into play,
With <1μm spacing, you’re leading the way!
You’ll laugh at the bumps! You’ll scoff at the paste!
With hybridized bonds, there’s no time to waste.
For logic and memory now kiss on the head,
And the thermal resistance? “No worries,” you said.
Oh, the nodes you’ll shrink! The paths you will trace!
You’ll jam more transistors in less and less space.
And maybe one day, as the roadmap proceeds,
You’ll bond qubits too, for AI that reads.
