Telecommunication networks are undergoing a rapid transformation. With 5G rollouts, edge computing, and a surge in IoT devices, the pressure on semiconductor performance is higher than ever. But today’s chipmakers aren’t just racing to deliver speed and power—they’re also being challenged to meet complex regulatory requirements and ambitious sustainability goals.
Henkel’s recent industry survey reveals a clear picture of what semiconductor manufacturers are prioritizing in telecom-related chip design and packaging. Three pillars dominate the landscape:
- 4% cite regulatory compliance as a primary challenge
- 4% prioritize next-level performance
- 9% emphasize sustainability goals
These priorities define the new reality of semiconductor innovation for telecommunications.
The Compliance Challenge
Semiconductor companies serving the telecom sector face some of the industry’s strictest compliance demands. From traceability of raw materials and documentation of component origins to export control and certification protocols, regulatory requirements can dramatically increase cost and complexity.
Manufacturers must maintain robust quality systems while staying agile enough to innovate—a balancing act that demands precision in both process and partnership.
Performance Under Pressure
With data traffic soaring and real-time computing on the rise, chips must perform flawlessly. Survey results show that:
- 1% of respondents rate reliability as a top priority
- 3% want faster chip performance
- 9% are focused on managing manufacturing complexity
- 9% aim to support edge AI adoption
- 4% prioritize wide bandgap semiconductors (SiC/GaN)
- 4% emphasize higher integration and sophistication
Achieving these goals requires integrating RF components, improving thermal control, and ensuring signal integrity—all while managing space constraints. Advanced packaging and material technologies play a vital role in enabling these capabilities.
Sustainability by Design
Sustainability is no longer optional—it’s expected. Companies are actively seeking ways to reduce the environmental footprint of semiconductor packaging, from material sourcing to end-of-life disposal. As one survey respondent shared, “There is growing interest in reducing the environmental impact of packaging throughout its life cycle.”
Designing for sustainability includes using energy-efficient materials, minimizing waste, and selecting formulations that support long-term durability and recyclability.
Material Innovation as a Driver
To support this trifecta of needs, survey respondents identified key material requirements:
- 3% need gap fillers for large packaging gaps
- 7% require package stabilization solutions
- 9% depend on underfill and encapsulation materials
- 8% highlight the need for wafer-level handling of large, thin dies
- 0% seek high-performance die-attach materials
These engineered materials are critical to managing heat, improving reliability, and ensuring long-term performance under demanding telecom conditions.
Moving Telecom Forward
At Henkel, we collaborate with semiconductor leaders to develop advanced packaging solutions that address this trifecta. Whether supporting 5G infrastructure or laying the foundation for 6G, our materials help manufacturers balance regulatory requirements, performance needs, and sustainability goals.
Let’s shape the next generation of telecom together.
Learn more in our comprehensive research report here “Peer viewpoint: semiconductor innovation for telecommunication networks”
