MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions at the 26th China International Optoelectronic Exposition (CIOE) from September 10-12, 2025, in Shenzhen. With over 40 years of industry experience, MRSI Mycronic will highlight die bonding and active alignment solutions focused on precision, speed, and reliability for evolving market needs. AI clusters are driving demand for faster optical interconnects and precise packaging of single- and multi-mode transceivers. MRSI will also present at the Infostone Optical Communication Market and Technology Conference (IFOC).
MRSI will demonstrate how the MRSI-LEAP delivers high precision and stability for the mass production requirements of AI-driven high-speed optical modules. This advanced die bonder supports a range of epoxy bonding processes, including stamping, dispensing, UV curing, wafer-level packaging and flip-chip assembly. Especially, it has unique multi-die eutectic solutions designed for speed-up 1.6T optical modules delivery.
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems will present “AI Optical Module Packaging Technology Evolution and MRSI Solutions” at the 23rd Infostone Optical Communication Market and Technology Conference (IFOC) in Shenzhen, China. The conference will be held at the InterContinental Hotel of Shenzhen International Convention and Exhibition Center from September 8-9, 2025.
Dr. Zhou stated, “We are pleased to take part in CIOE 2025 and present our most recent innovations. With our ongoing dedication to providing advanced die bonding, active alignment, and dispensing solutions, we anticipate meaningful engagements with current and prospective customers.”
We invite you to visit our booth to learn more about our latest products and applications. MRSI’s technical experts will be present to engage in detailed discussions regarding your specific application requirements. For further information, please stop by booth #10B79 at CIOE or contact us directly to arrange a meeting to explore our innovative technologies and capabilities.
