Smoltek is awarded yet another approved patent, the fourth this year. The patent is also the third in a patent family protecting solutions for interposers based on the CNF-MIM capacitor concept. This means that our patent portfolio now comprises 59 granted patents.

The patent covers our CNF-MIM capacitor technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.

“It is very rewarding that the dedicated efforts to generate a new wave of inventions now starts to pay off. This patent is a recognition of that our technological approaches and concepts are cutting edge and innovative”, says Dr Shafiq Kabir, Founder and Chief Innovation Officer at Smoltek.

Interposers are frequently used in today’s advanced packaging architectures for integrated circuits, for example commonly used for microprocessors and heterogeneous integrations. The present patented concepts are built on the need to improve circuit performance by enabling smarter interposers that integrates one or several compact energy storage devices. Smoltek’s inventions facilitate integration of extremely thin solid state energy storage devices, such as CNF-MIM capacitors, closer to the interconnection points and power rails of the active chips. The CNF-MIM technology offers industry’s smallest formfactor for integrated high-performance capacitors, this by providing very high capacitance per area at a fragment of height compared with today’s technologies.

Dr Shafiq Kabir concludes: “South Korea is an important market for our technology, hence it is of high importance to have a footprint with our new set of IP in such market. This goes in line with our constant strive for solid IP protection of our R&D schemes that bring new disruptive solutions to problems that traditional technologies cannot efficiently address.” Smoltek’s patent portfolio now globally comprises 59 granted patents. Read more about our IP and patents.


Smoltek is a global technology provider for the new wave of advanced packaging and heterogenous…

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