At the recent IMAPS Device Packaging Conference, March 5-7, 2019 in Fountain Hills AZ, Benedetto Vigna, president of the ST Micro Analog, MEMS and Sensors Group, discussed the company’s presence in the sensor technology market.
The vast assortment of sensor and actuator functions have recently been defined by Yole Developpement as shown in Figure 1.
2018 IHS market data shows >50% of the sensors market remains in the personal electronics market segment and that optical sensors control a majority of market share.
While the widespread use of automotive airbag sensors started in 1989, the broad use of sensor technology has really been an event of the 2000s with the adoption of the CMOS Image Sensor ( CIS ) and the silicon microphone.
In Figure 3, Vigna lists the emerging industrial applications driven by sensors.
The use of sensor technology will be prevalent during the complete cycle of shipment, installation, and operation as shown in Figure 4.
Of course, we all are aware of the pervasiveness of sensors in the recent plethora of smart driving applications (Figure 5).
And health monitoring will become a sensor-driven business (Figure 6).
I think we would all agree that the sensor business will be a high growth business in the future and thus we should stay aware of sensor packaging trends in the future. Certainly, IFTLE has been following image sensor packaging technology since it became the early adopter of 3D IC technology in 2008.
It is also clear that many of today’s advanced sensors, taking the lead from the CIS segment, are being manufactured using wafer level packaging technology as shown in Figure 7. IFTLE certainly thinks that advanced sensor technologies will be a major growth area and advanced packaging will be one of the technologies enabling its adoption into the applications of the future.
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