Archives August 2016 - 3D InCites

Top Ten Reasons to Attend the 2016 European MEMS Summit

Top Ten Reasons to Attend the 2016 European MEMS Summit

Ok everybody, here it is, back by popular demand: the TOP TEN reasons (this time told in photos) why you don’t want to miss the second annual European MEMS Summit, which takes place September 15-16, 2016 at the Maritim Hotel Stuttgart Germany: 10: You get to mix and mingle with key decision makers at the industry’s largest MEMS and sensor business and technology conference. 9: You’ll... »

Will Fan-out Packaging be Sustainable Long-term?

Will Fan-out Packaging be Sustainable Long-term?

2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of fan-out packages. Yole Développement (Yole) is analyzing the current market and technologies trends and offers you to discover these results within a new report entitled Fan-Out: Technologies & Market Trends 2016. TSMC investment in fan-out wafer... »

SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging

SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging

System integration is moving forward.  Denser and high performing systems require advanced packaging, assembly, and test players to move closer together, and they mandatorily need to be involved in the collaboration along the full supply and value chain from the early beginning of new projects. The package is becoming a functional part of the product and with it a differentiator for the product... »

Discussing Panel Scale Packaging at SEMI’s Northeast Forum

Discussing Panel Scale Packaging at SEMI’s Northeast Forum

SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical content presented on the show floor, content that included (pleasant surprise) a full track devoted to advanced packaging topics. Definitely not business as usual. The distinction between where fab processes end and where packaging processes begin is blending more and more, thanks to trends like More t... »

The Great Divide Between Semiconductor Design and Manufacturing

The Great Divide Between Semiconductor Design and Manufacturing

Shortly before the summer break started, I attended a number of industry conferences: MEPTEC, ECTC, DAC, MEMS & Sensors, ASME and SEMICON West. At all of them, I clearly noticed that our industry is looking beyond “Moore’s Law” to advanced IC packaging, multi-die ICs, and system scaling. However, at every one of these conferences, I also noticed the “Great Divide”: It’s difficult t... »

Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit

Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit

The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the summit will feature numerous market experts to speak about cost models, business strategies, and market outlooks. Here’s a sneak peek at the Market and Business line-up: Jeremie Bouchaud Sensors for IoT: How Big is the Market Going to Be? Jeremie Bo... »

Fraunhofer IZM Panel Level Packaging Consortium Launches in Berlin

Fraunhofer IZM Panel Level Packaging Consortium Launches in Berlin

In the bric-à-brac collection that seems to form my particular set of memories and mental associations, I have at least two old somethings crowded in a Berlin corner that I have been looking after for years, a corner to which I have now recently added something new and exciting. And work related. The two old somethings are the writings of Christopher Isherwood (“The Berlin Stories”) and the m... »

SEMI 2020: Transforming for the New Supply Chain

SEMI 2020: Transforming for the New Supply Chain

2015 will be remembered mostly for the ‘wild ride’ that fundamentally changed the industry.  An unprecedented wave of M&A activity swept across the electronics supply chain with scores of transactions and with notable multi-billion dollar companies being absorbed.  As a result, in 2016, we are working within a significantly reshaped supply chain. To support this, we have launched the SEM... »