Archives August 2015 - 3D InCites

Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?

Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?

The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND technology, based on a monolithic 3D IC process, True 3D™ IC, claiming to be the “lowest cost-per-bit in the NAND market.” With all the recent 3D NAND discussion and announcements about Samsung, Toshiba, and Intel and Micron’s 3D X-point, I wanted to know more. Spec... »

BeSang Inc. announces 3D super-NAND flash memory

BeSang Inc. announces 3D super-NAND flash memory

BeSang Inc., a pioneer in the monolithic 3-dimensional integrated circuits (3D ICs), announced today its proprietary 3D super-NAND development. “We are pleased to announce 3D super-NAND, which is expected to be the lowest ‘Cost-per-Bit’ in the NAND market,” said Dr. Sang-Yun Lee, founder and CEO of BeSang Inc. “For the first time in the semiconductor industry, 3D super-NAND brings paral... »

Advanced Packaging and 3D IC Market Driving Strong Growth for EV Group’s Automated 300mm Polymer Adhesive Wafer Bonding Systems

Advanced Packaging and 3D IC Market Driving Strong Growth for EV Group’s Automated 300mm Polymer Adhesive Wafer Bonding Systems

ST. FLORIAN, Austria, August 31, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems. Over the past 12 months, the company’s order intake has doubled for these systems, including the ... »

Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived!

Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived!

Chalk up another industry first for Tezzaron Semiconductor, who announced just today (or tomorrow, if you are there for the excitement at IEEE 3DIC in Sendai, Japan) that along with their manufacturing subsidiary, Novati Technologies, they have successfully manufactured the world’s first eight-layer 3D IC wafer stack containing active logic. (Figure 1). According to Tezzaron, the logic-on-log... »

Tessera to Acquire Ziptronix, Inc. for $39 Million

Tessera to Acquire Ziptronix, Inc. for $39 Million

SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D IC solutions to semiconductor industry customers. Ziptronix’s patented ZiBond... »

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent “adjustments” in the stock markets worldwide as a series of events disrupting the summer doldrums. But I am not here to give you investment advice. So let’s move on to a subject I am more familiar w... »

TechSearch International Analyzes CSP Market Growth:  QFNs Remain “Work Horse” of the Industry

TechSearch International Analyzes CSP Market Growth: QFNs Remain “Work Horse” of the Industry

Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International’s latest CSP market forecast shows an 11% CAGR from 2014 to 2019. One of the categories with the strongest growth is the quad flat no-lead (QFN) package. QFNs remain the “work horse” of the industry with growth driven by conversion from other leaded packages as well as adoption in new... »

Executive Viewpoint: Update on Cleans

Executive Viewpoint: Update on Cleans

Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we talked about the importance of cleans for 3D ICs. Dynaloy, a subsidiary of Eastman Chemical Company, develops and creates chemistries specifically for the removal of photoresist, etch residues and other polymers. At the time, Pollard impressed upon me the concept that what we are really talking about... »

3D NAND at the 2015 Flash Memory Summit – Slipping the Surly Bonds of Earth?

3D NAND at the 2015 Flash Memory Summit – Slipping the Surly Bonds of Earth?

It’s been many years since I realized that semiconductor conferences were not purely scientific but had a certain mix of marketing razzmatazz. Well, the 3D NAND razzmatazz was in full swing last week at the 2015 Flash Memory Summit in Santa Clara, California. I went along for two reasons. The first was to attend “Creating the Foundation of Flash – A Conversation with Eli Harari” and t... »

New Competence Center for Nanoimprint in North America

New Competence Center for Nanoimprint in North America

Garching/Germany, August 18, 2015 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field of nanoimprint technologies. As part of this cooperation, Penn has recently received the equipment set and th... »

Page 1 of 212