Are you going to this year’s MEMS Executive Congress? I was invited, but unfortunately won’t be able to attend. I’m sad about that – it was a great event last year and I learned alot about the synergies between MEMS and 3D ICs. As you probably know, MEMS are already 3D by design. By themselves the can’t do much, and need to be connected to an IC to function; a recent goal here is to use an IC as a cap, using a TSV as a method of interconnect.
Anyhow, according to my friend and colleague, Karen Lightman, Director of the MEMS Industry Group, this year’s event promises to be even more entertaining because for the first time, it will feature a demo event of some of the coolest, most compelling MEMS enabled applications yet. Here’s her latest blog post on the subject:
MEMS Industry Group’s (MIG) first “MEMS Technology Showcase” will give MEMS Executive Congress attendees an intimate look at some of the most unique MEMS-enabled applications in the business. After a competitive application process, MIG selected seven finalists that show how MEMS enhances the user experience with electronic devices, highlighting the “MEMS inside the machine.” Each finalist will get five minutes to wow the audience, who will text-message votes for their favorite demo. Panel moderator Sam Guilaumé, CEO, Movea, will “crown” the winner at the end of the day.
If you do make it to the event – I have a task for you – see if you can find out which of these sexy new MEMS applications are using 3D IC technologies and let me know. I’ll be happy to post a guest blog for you. ~ F.v.T.