San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused on the subject continue to emerge. Last week, 3D-ICs.com, a web portal that automatically mines the internet for news, blogs and technical publications related to 3D-ICs was launched, joining the well-regarded 3D InCites in the effort to promote 3D-IC adoptio... »
I knew we were onto something when Leo Archer and I chose 3D ICs and 3D packaging as the top of focus two and a half years ago when we first launched 3D InCites. The intention was to play off the word “incite” was to stir up interest in this emerging area of technology, while also capitalizing on the I C in the word InCites. Clever, no? Not everyone gets the name, (many think the name is »
What the room heard: Get ready for a second downturn. DRAM is in the tank because PC production is down, causing ASP price erosion. All sorts of indicators mean that the semiconductor industry isn’t out of the woods yet. What I heard: The sweet spot for growth is being driven by smart phones, tablets, and SSDs. If you’re in that area of the market, things are looking up. I ask you, is it »
Ultratech has earned ISO 9001:2008 and 14001:2004 certification from the DQS-UL Group for its international operations headquarters in Singapore and recertification for its San Jose facility. Ultratech recently announced the opening of its Singapore operations, which includes engineering and manufacturing of its lithography systems and other related products, in addition to housing the company's i... »
The Silicon Integration Initiative (Si2) announced today the founding members of their Open3D Technical Advisory Board (TAB), which is chartered to enable interoperable 2.5D and 3D design flows with open standards, providing common formats and interfaces. The founding members of the Open3D TAB are: ANSYS (ANSS), Atrenta, Cadence Design Systems (CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, Intel ... »
Honeywell Microelectronics and Tezzaron Semiconductor are working together to produce a new range of radiation-hardened (rad hard) integrated circuits. Honeywell’s sturdy, well-qualified S150 processwill use Tezzaron’s 3D stacking to greatly increase circuit density without migrating to a smaller node. The resulting three-dimensional integrated circuits (3D-ICs)are also expected to use »
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ. Technologists from SEMATECH’s 3D Interconnect program have demonstrated a novel die-to-wafer interconnect process using a d... »
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