Archives January 2009 - 3D InCites

The TGIF 3D Buzz

As my first official week blogging about 3D IC packaging technologies winds down, I'm thinking a Friday wrap-up is in order, and should probably become a regular event. (Being a fly-by-the-seat-of-your-pants kind of person, it's only natural that this blog takes shape as the opportunities present themselves, don't you think?) »

Even the Magic 8 Ball couldn’t have called it

In my last editorial as managing editor of Advanced Packaging magazine, I suggested we should turn to the Magic 8 Ball to predict the rebound of the semiconductor manufacturing industry. But even my trusty 8 Ball couldn't have predicted my fate a week later, when the decision was made to integrate Advanced Packaging into Solid State Technology. However, as I've been told by many pioneers of emergi... »

CEA-Leti: A visit to the mother ship

If your company is located in France, and/or is involved in micro and nanotechnologies for microelectronics, chances are it’s either a spin out of Leti, its parent organization CEA, or is closely tied in ongoing collaboration to this major European research center for applied electronics. At least that is the impression I came away with after visiting Leti at its Minatec campus in Grenoble, ... »

New Year Ramblings

Ok, I realize it’s not really the New Year, but for me, September is always about beginnings. The school year gets underway on most continents (except in Arizona, where its been in full swing for three weeks). It marks the end of summer holidays in Europe (Is August also holiday season in Asia? I need to find that out.) Most importantly, my semiconductor career began in September. So its really ... »