SEMI-THERM focuses on “thermal innovations that make the worlds’ technology cool.” SEMI-THERM 31 features critical information for thermal and non-thermal professionals. Learn about and share advances in thermal management, measurement and modeling.
For attendees focused on thermal issues for 3D integration technology, you’ll want to check out these events:
Short Course # 4: Three-Dimensional Packaging: Manufacturing and Thermal Concerns
Monday, March 16, 2015 1-5pm
Instructors: Jesse Galloway Ph.D., Amkor Technology
With space at a premium in mobile platforms, and in some infrastructure applications, three-dimensional packaging structures are viewed as the key to increasing packaging density and improving electrical performance. This tutorial explores the evolution of packaging structures from its beginnings, where individual packages were stacked on top of one another, to more complex multi-level integration. Included is a historical discussion of the shrink in the interconnect pitch and the opportunities it provides for more complex die integration. An overview of the manufacturing challenges, such as warpage and testability are reviewed with a look towards future requirements. Lastly, design requirements are explored from a thermal analysis point of view. Specific thermal analysis examples are provided for package-on-package (PoP), stacked die and silicon interposer structures.
Technical Sessions: (March 16-19)
System Level Cooling This session focuses on system level cooling and will address telecom related applications, consumer products such as tablets and cell phones, as well as applications using liquid cooling. Significant work goes into ensuring that as functionality is increased and product size is reduced that surface temperatures do not cause discomfort to the user. The power density projected for current and next generation telecom products requires careful analysis as well as innovative solutions. The rapid adoption of tablets and other small form-factor consumer devices requires good thermal design as well as investigation of technologies that can result in additional size/shape/functionality that are attractive to consumers. High density challenges as well as energy cost has caused the industry to give more consideration to liquid cooling.
Mobile and Graphics Challenges The functionality of hand held devices have increased recently. However, functionality and performance depend on the power dissipated by different chips. Unlike other electronic equipment, handheld devices are thin and small in size which makes it challenging to use active cooling. Thus, the thermal management options become limited and depend basically on spreading the heat. There are two thermal constraints in handheld devices: outer case temperature and component junction temperature. If the temperature exceeds its limit on one of these, the chip will start throttling and thus the performance will get a hit. In this session, we will talk about thermal challenges that face handheld devices, ways to improve thermal management, and thermal throttling.
Visit the SEMITHERM Website for full details and session times
