ACM Research Expands into Chemical Vapor Deposition Market to Support Logic & Memory ManufacturingDec 12, 2022 · By ACM Research · Press Releases FREMONT, Calif., Dec. 12, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for...
CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVDSep 27, 2017 · By KOBUS Technology · Press Releases Montbonnot, France, 20th of September 2017 ̶ KOBUS, a leading equipment supplier in advanced deposition solutions, and Leti, a technology...
The FAST route to the Top of the TSV MountainMar 08, 2017 · By Francoise von Trapp · Blogs . While on a recent visit to UnitySC in Grenoble, France, I spent some time visiting with a semiconductor process...
At the Crossroads of CVD and ALD, KOBUS Makes its Mark on 3D TSVsNov 15, 2016 · By Francoise von Trapp · Blogs Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as...
Advancements in Carbon Nanostructures for Advanced Packaging ApplicationsJun 16, 2016 · By Smoltek · Resource Library Moore’s law has guided the continuing miniaturization and performance enhancements of silicon chips for the semiconductor industry by scaling the...
FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition ToolsApr 19, 2016 · By Francoise von Trapp · Press Releases Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in...
ACM Research: New Kid on the 3D BlockDec 13, 2012 · By Francoise von Trapp · 3D In-Depth Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an...
NEXX Systems Joins Tokyo Electron (TEL) as a Wholly Owned SubsidiaryMar 16, 2012 · By Francoise von Trapp · 3D In-Depth Tokyo Electron Limited announced the completion of a definitive acquisition agreement with NEXX Systems Inc. Over the years, NEXX collaborated...
Altatech Semiconductor’s 300 mm CVD System Being Used in 3D IC Pilot Production at ASSIDNov 10, 2011 · By Francoise von Trapp · 3D In-Depth All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM...
SPTS – It’s all in the TimingJul 29, 2011 · By Francoise von Trapp · Blogs One year ago today, I was sitting with David Butler and Kevin Crofton, of SPTS, at the company headquarters in...
SPP Process Technology Systems (SPTS) Celebrates One Year AnniversaryNov 22, 2010 · By Francoise von Trapp · 3D In-Depth SPP Process Technology Systems (SPTS), a subsidiary of Sumitomo Precision Products Co., Ltd. (SPP), celebrates one year since it began...
Planes, Trains and Automobiles….Jul 31, 2010 · By Francoise von Trapp · Blogs Oh…..and a bus. It takes one of each to get to Newport, South Wales from Munich.
SPTS: A Wild Ride to SuccessFeb 09, 2010 · By Francoise von Trapp · Blogs A year ago, things weren’t looking so great for Aviza Technologies. According to Kevin Crofton, executive VP, SPTS and managing...
Discussion Summary: Overcoming weaknesses in dry processes for TSV metallizationSep 25, 2009 · By Francoise von Trapp · 3D Event Coverage This week’s online forum with Alchimer’s executive team, Steve Lerner, CEO; Kathy Cook, Director...