Francoise in 3D

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Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.

What I Learned At ECTC 2022

I’ve started so many event blog posts since the return of live events with the phrase – it’s good to be back! But it bears repeating. And with ECTC 2022 weighing in with record attendance at about 2000 attendees, it’s clear that we are all pretty much done with virtual...

Apple M1 Chipset

IFTLE 518: Apple M1 UltraFusion Technology

Apple announced that it’s launching the new M1 Ultra processor for high-end Macs during its ‘Peek Performance’ event in March and announced the mysterious “UltraFusion” as Apple’s “custom-built packaging architecture.” Let’s take a closer look! Is Apple M1 using TSMC CoWoS technology? The Apple M1 Ultra is currently only available...

Taking Strides for DEI: Fund Raising Efforts Bring in 25K

We are pleased to announce that thanks to the support of our industry partner, the International Microelectronics and Packaging Society; and the generosity of all our sponsors for the 2022 3D InCites Awards, our annual Mural Project, and the First Annual Hike for DEI; we raised $25,000 for the 3D...

2022 IMAPS DPC: Back and Better Than Ever

After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS Device Packaging Conference (IMAPS DPC). With over 400 attendees, it felt like the good old days. While it wasn’t the first in-person conference we’d attended; it did feel more like...