Francoise in 3D

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Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.

Raise A Glass to The New 3D InCites Community!

Happy New Year and welcome to the new 3D InCites community platform! We marked 2019 by celebrating our tenth anniversary, so it seems appropriate to kick off the next decade (for the world and us) with a new look and feel for our website. You all may remember the blog...

The IWLPC Fan-out PLP Smack Down

At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP)...

How 5G is Enabling a Connected World

It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in...

Supporting the 3D Megatrend in Semiconductor Manufacturing

We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies...