Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
People often tell me that I say out loud what everyone else is thinking. So there it is. It’s July 1, 2021, and I have to admit I’m feeling a little off. Probably because this time of year we are usually in the throes of SEMICON West preparations. Even last...
For the first time in its 71-year history, the ECTC committee veered away from strictly technical topics to include a panel discussion on market trends and the economic outlook. Moderated by SemiEngineering’s Ed Sperling, much like a relay race, the session was structured to start with the big picture story,...
Over the past month, you may have noticed a new addition to the 3D InCites platform. The 3D InCites Podcast made its debut on May 5, 2020, with a conversation with Kiterocket’s Joe Cestari, about how to successfully market a semiconductor business. The second episode featured 3D InCites bloggers, Julia...
I was recently invited by IMAPS UK to give a keynote at their annual conference, MicroTech 2021. The topic was Heterogeneous Integration (HI). I agreed, provided I was allowed to give the topic a new twist. I provided the following abstract, and the committee eagerly agreed to my proposal: A...
Leave it to Bill Chen, ASE, to set an optimistic tone for the 2021 Global Business Council Spring Meeting. It was exactly what the packaging community needed to hear. The last time many of us met in person at an industry event was at the 2020 IMAPS Device Packaging Conference...
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular, Direct Bond Interconnect (DBI®) is quickly becoming the preferred permanent bonding path for forming high-density interconnects in a multitude of applications, from image sensors and MEMS devices, and most recently...
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments for celebrating its winners. We can’t gather in person at the IMAPS Device Packaging Conference to applaud the winners, catch up with colleagues over a great barbeque, watch the 3D...
For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in support of STEM Education. This year, we have initiated a new fund in support of Diversity, Equity, and Inclusion (DEI). Because DEI is critical to the UN Sustainable Development Goals,...
As part of our annual 3D InCites Awards program, we decided this year to turn the spotlight on two areas that we think are critical for the future of society: sustainable semiconductor manufacturing and diversity, equity, and inclusion (DEI). These topics are so important that we chose to have the...
After a year living in the shadow of COVID 19, the speakers at the Technology Unites Global Summit Executive Forum have some positive news to share about its impact on the semiconductor industry and vice-versa. The verdict is unanimous: COVID 19 catapulted the digital transformation into reality, which means explosive...
