Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
Over the past few years, we’ve seen KLA evolving from its origins as a process control company focused on front-end solutions, to a more holistic organization that extends its reach into more segments of the electronics chain, like, packaging, display, and components. The ICOS inspection product line got it pointed...
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming to life out on the veranda of the conference center, where the receptions, poster session, and 3D InCites Awards Ceremony takes place. Created by illustrator, Ronna Encarnacion, the mural is...
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this month, I viewed the 3D Past, Present, and Future of 3D integration Plenary Session. The actual viewing time is just over 115 minutes. The impressive speaker line-up included 3D pioneers,...
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is nearly as old as the industry itself and has successfully evolved right alongside it. So ERS electronic GmbH, located in Germering, Germany, was ready to celebrate in a big, big...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately, evangelizing heterogeneous integration technology (HIT) as the new path going forward for the semiconductor industry. In fact, the ECTC 2020 keynote is Yu’s third keynote presentation at key h this...
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC 2020 free of charge. The elimination of travel expenses and making the pre-recorded sessions available until June 30th is helping to boost registration from about 1500 to well over 5,000...
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer DBI. Excited to celebrate this momentous occasion with them, I even wore the Xperi logo for the photo. Here we are a year later, and although I won’t have the...
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites Community has already grown to 29 members. I visited with a few of them in person at IMAPS DPC to learn more about them, get updates on their activities in...
At last month’s IMAPS Device Packaging Conference, when I was not in keynote sessions, I was spending time chatting with industry colleagues to get their take on industry drivers. In all honesty, there was less talk about technology and more about the Coronavirus, which was still just barely hitting US...
When people weren’t talking about the coronavirus at this year’s 2020 IMAPS Device Packaging Conference and its co-located Global Business Council, they were talking excitedly about the arrival of the golden age of packaging, heterogeneous integration, and most specifically, chiplet integration. Keynote speakers (Doug Yu, TSMC; Christian Hoffman, Qualcomm Germany;...
