Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
Did you see the title and check your calendar? Did the year just speed up? You thought the 2024 3D InCites Awards didn’t get underway until January! That was last year. We’ve made some changes to improve the impact of the 2o24 3D InCites Awards, and that means kicking things...
Fourteen years in existence, 3D InCites has been through some changes, from being a basic blogging platform focused only on emerging 3D integration technologies, to the full-blown heterogeneous integration community it is today. We don’t only talk about technology – we play a role in making it happen. Our podcast...
Is the Wild West becoming America’s center of microelectronics innovation? Based on the current wave of activity across the semiconductor supply chain, it’s starting to look that way. I’m not just talking about TSMC’s gigafab, or Intel’s expansion, although these industry giants have a lot to do with what’s happening...
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose. Right out of the gate, it reminded me of the early days of RTI’s 3D ASIP Conference that I attended for nine straight Decembers in Burlingame, CA. The single-track format...
I’ve had about a week to process, ponder, and reflect on all the information I absorbed last week at SEMICON West 2023. From the speakers at imec’s ITF USA and SEMICON West’s CEO Keynote Summit to the numerous podcast interviews with industry experts, it all boils down to one key...
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb at the 2023 Electronics Components Technology Conference (ECTC 2023), which took place May 31-June 2 in Orlando, FL. The keynote and panel sessions discussed technical topics including quantum computing, chip-to-wafer...
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination of explosive growth and a maturing workforce. Competition for STEM talent in other industries has made it difficult to recruit the latest generation of graduates, who are lured by seemingly...
For the first time in 3D InCites’ history, I was invited to attend a TSMC Technology Symposium, which took place April 26 at the Santa Clara Convention Center. You might be asking, why was this my first time? Great question! I always assumed it was because Herb Reiter, our EDA...
14 years ago, I had an idea to create a content platform devoted to the advancement of semiconductor 3D Integration technologies. I called it 3D InCites because to “incite” means to “stir up interest in”. I also liked the play on 3D IC. I started attending industry events and blogging...
The donations are in, the expenses tallied, and we’re excited to report that the 3D InCites DEI Fund has grown to a healthy $61,672.52 thanks to the generosity of our 2023 3D InCites Awards sponsors, our annual Mural Sponsors, and our second annual Hike for DEI, and our event partners,...
