Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for advanced packaging applications. Thanks to ongoing research and development, a clear path has emerged for the use of glass in two key areas: as carrier substrates for high-density fan-out (FO) packages and as glass interposers for 2.5D integration. At ECTC 2019, I spoke w... »
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve watched it grow from its humble, start-up beginnings as a Ziptronix process to its current rock-star status at Xperi/Invensas, as THE current hybrid bonding technology process for image sensors globally. All along the way, I’ve been a diehard fan of this elegant process (AND its entir... »
On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the past few years, fan-out panel-level packaging (FOPLP) has been in hot debate: is it needed? Does it REALL... »
In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a swirl of presentations, conversations, and networking events. Last week, (May 27-31, 2019) Las Vegas played host to 1563 attendees (the second highest number ever), who gathered to share and learn about the latest trends, drivers and technologies that make the microelectronics industry t... »
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes place at the Cosmopolitan in Las Vegas, from May 28-31. I’m excited to announce that my good friend and SemiSister, Nancy Stoffel, General Electric Research is this year’s General Chair. I’d tell you about our escapades the last time ECTC was in Las Vegas.... »
When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level Packaging Technology, I was a little apprehensive. I reminded them that I was NOT an engineer, so would only be able to review it from the layperson’s perspective. They assured me that was precisely what they were looking for, so I agreed. Written by Experts When the book arrived ... »
In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved up further? The Basics Phoenix, AZ-based ON Semiconductor (ON Semi) announced its second big acquisition in the past month: the purchase of GlobalFoundries’ (GF) East Fishkill 300mm semiconductor fab. The first was the acquisition of WiFi technology... »
Why are sensors not on the same growth trajectory as CMOS? In the face of a shaky global economy, where are the opportunities coming from? How will doctors practice medicine five years from now and how will MEMS and sensors be involved? What are some of the cool, upcoming sensor-enabled devices that will change how we interact with the world? These questions and more were the topics of discussion ... »
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I covered was the IMAPS Device Packaging Conference in 2009. We officially launched the first website in time for SEMICON West 2009. Remember the logo? Things could only improve from here. In 2012, now... »
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why I chose to focus 3D InCites on the advanced packaging segment of the semiconductor industry. The technology is fascinating and varied, the conversation is inspiring, and the people know how to have a... »
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