Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.

Advanced Packaging evolution Advanced Packaging COO FullSizeRender 25

The Advanced Packaging Times, they are A-Changing…or Are They?

It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had plenty of time to mull over the many presentations and conversations focused on advanced packaging trends. The winds of change are blowing ever so slightly from year’s past. You had to listen carefully, and in some cases, read between the lines so not to miss them. I could rep... »

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!

Here we go again! One thing is for sure, there is never a dull moment at the IMAPS Device Packaging Conference panel sessions. (Remember the year of Alphabet Soup?) Maybe it’s because they take place AFTER everyone’s had a few drinks, but this year was especially lively and entertaining. There was humor, there was drama, AND there was a really good story being told at the fan-out panel discus... »

IMG_3594 IMG_3595 IMG_3596 IMG_3653 IMG_4047

The FAST route to the Top of the TSV Mountain

. While on a recent visit to UnitySC in Grenoble, France, I spent some time visiting with a semiconductor process equipment company that shares the same cleanroom space: KOBUS. Named for a genus of the African antelope for its elegance and speed, the company has developed a unique approach to deposition for through silicon via (TSV) metallization processes (barrier, seed and fill) combining the pe... »

What’s in Store For You at IMAPS DPC 2017

Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is geared to inspire attendees about the growing importance of heterogeneous integration technologies supported by advanced wafer level packaging, 2.5D, and 3D integration. While the quest for smaller silicon nodes continues, it’s well understood that these technologies are fi... »

Screen Shot 2017-02-15 at 3.11.26 PM Screen Shot 2017-02-15 at 3.10.41 PM Screen Shot 2017-02-15 at 2.59.56 PM

Using 3D Integration to Get the Heat Out

Thermal management is one of the last vestiges of 3D integration challenges. As such, the European 3D Summit (Jan 23-25, 2017) devoted its entire R&D segment to explore what is in the works to solve this in a session titled Tackling the Thermal Management Challenge. Chaired by Jean Michailos, STMicroelectronics the session featured the following talks: Integrated and Self-Adaptive Microfluidic... »

Highlights from the 2017 European 3D Summit

The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging, 2.5D and 3D IC technologies being developed to achieve next-generation device requirements. In addition to informative sessions, attendees enjoyed some camaraderie, as we’ve all been meeting for a number of years to get 3D integration off the ground. The highlight ... »

Screen Shot 2017-02-08 at 8.52.11 AM Screen Shot 2017-02-08 at 8.52.22 AM Screen Shot 2017-02-08 at 2.16.19 PM Screen Shot 2017-02-08 at 2.19.35 PM

The Edge of 3D: 3D SoC VLSI and Si Photonics

Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways based on the closing remarks I delivered at this year’s well-attended event, which took place January 23-25, 2017 at Minatec Campus in Grenoble. In this post, we’ll take a deeper dive into some of the edgier technologies in development that were presented, and what is ... »


Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging

In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation fan-out wafer-level packaging (FOWLP), 2.5D interposer, 3... »

FOWLPvsFIWLP 3D packaging

2017 European 3D Summit: Making Advanced Packaging Great Again

Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve heard over the past year is that as 3D technologies move into manufacturing, it’s become difficult to recruit speakers who have fresh content. Notoriously slow to evolve, the 3D integration conversation hasn’t changed too much over the pas... »

img_8051 img_8110 img_8021 img_8126 img_8141 img_8140 ryb-eliot-offre-pepite-minatec-showroom_ardito_cea-1 img_8131 img_8101 img_8193 img_8195

Top Ten Reasons to Attend the 2017 European 3D Summit

It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly known as the 3D TSV Summit for editions 1-3), and it’s shaping up to be a stellar event. If you are still wavering about attending, here are 3D InCites’ top ten reasons to attend: 10: The opportunity to visit beautiful Grenoble, and taste the local fare with your industry colle... »

Page 1 of 46123»