Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.

IMG_6605 IMG_6881 IMG_6884

Technical Tidbits from IWLPC and MSEC 2017

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to fi... »

IMG_6866 IMG_6867 IMG_6866 2 IMG_6800 IMG_6801

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of some of the greatest minds in the industry. While the presentations are always top-notch, it’s the stimulating dinner conversations they inspire that I look forward to most. This year, I decided to leave the straightforward reporting to my journalist collea... »

robot Screen Shot 2017-11-06 at 3.22.44 PM Screen Shot 2017-11-06 at 3.27.14 PM

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?

I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices, cities, cars, and factories possible, are often the slowest to adopt them. So it was with great interest that I listened to Guillermo Novo’s keynote at a recent SEMI Arizona Breakfast Forum, which kicked off a morning of presentations focused on smart manufacturing,... »

IMG_6598 IMG_6602 IMG_6615 2

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level Packaging Conference (IWLPC), when Jan Vardaman made it the topic of a panel discussion, and told a cautionary tale of following PLP down the rabbit hole. It seems that ever since, PLP has been an event h... »

Screen Shot 2017-10-04 at 1.44.57 PM Screen Shot 2017-10-04 at 3.08.56 PM Screen Shot 2017-10-04 at 3.12.24 PM Screen Shot 2017-10-05 at 8.51.11 AM IMG_6360 Screen Shot 2017-10-05 at 9.16.44 AM

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

There’s no doubt about it. Imaging sensor technologies have come a long way since the introduction of the digital camera. In fact, according to Gartner, image-based sensors will be the single largest category of devices for the internet of things (IoT) sensing (figure 1). That fact was made imminently clear a few weeks ago at the European Imaging and Sensors Summit, which took place September 21... »

Screen Shot 2017-10-02 at 8.55.15 AM IMG_6176 Screen Shot 2017-10-02 at 10.53.15 AM Screen Shot 2017-10-02 at 12.58.54 PM Screen Shot 2017-10-02 at 1.46.52 PM IMG_6237

Spotlight on the European MEMS and Sensors Technology Showcase

As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tracks —the MEMS and Sensors Technology Showcase and The Imaging Sensors Start-up Pitches — did not run in parallel. As a result, I attended both. This post focuses on the MEMS and Sensors Technolog... »

IMG_6387 Screen Shot 2017-09-27 at 4.03.02 PM Screen Shot 2017-09-27 at 4.18.41 PM Screen Shot 2017-09-27 at 4.34.48 PM Screen Shot 2017-09-27 at 4.39.21 PM FullSizeRender 2 IMG_6213

Making Sense of MEMS and Sensors at the MEMS/Imaging Sensors Summits

Last week, I had a whirlwind trip to Grenoble, France: 3 days, 2 summits, and 1 supercool paragliding festival, Coupe Icare, on the side – all filled with “Aha!” moments. Ironically, the paragliding event I attended on Saturday drove home the point of the most stand-out talk from the week: Peter Hartwell’s (TDK-Invensas) impassioned presentation titled “Archiving and Sharing Your Experie... »

IMG_5260 1280px-Hands-free_Driving fullsizeoutput_1c8c Levels-of-AD

Will Fully Autonomous Vehicles Solve Global Transportation Problems?

Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry. So much so, that every event I’ve attended so far this year has featured sessions, presentations, keynotes, and panel discussions espousing the benefits of autonomous vehicles, the technologies that have been developed to enab... »


Xperi Sets Out to Enable Immersive Experiences

Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was Tessera, well-known throughout the advanced packaging sector of the semiconductor industry as an IP-based technology company focused on chip packaging and interconnects that historically licensed its technology know-how and patents. In 2003, the company formed a new parent company –... »

Chip last graphics file

The Brighter Side of SEMICON West 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had to click. I must admit, Mark is more of a hardcore technology journalist than I am,... »

Page 1 of 48123»