This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component, subassembly, circuit board, through to test and measurement, and enclosures, switches, the works. While my focus for this trip was SEMICON Europa, I took the long way to hall A4, wandering through the E... »
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any reason to exist. Think about that for a bit. There’s a reason “Semiconductors drive smart” was SEMI’s chosen theme for the event. Rather than attend all the sessions in the tech arena, I cho... »
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced packaging, and one that tied everything all together. At all of these events, the themes were consistent: advanced packaging rules; automotive and IoT is driving the train, and artificial intelligence and machine learning are the ones to watch on the hype... »
The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the MEMS and Sensors Executive Congress, in Napa CA. The winner gets a free table next year and is expected to share their progress. After a rapid-fire session of presentations and time to visit demo tables, their fate is in the hands of the attendees who have 24 hours to vote for t... »
Just over a year ago, Napa Valley was in flames, and the annual MEMS and Sensors Executive Congress (MSEC) had to be relocated from the Silverado Resort and Spa, located on the fringes of the Atlas Fire, to its sister hotel in San Jose, CA. So, it was with a bit of trepidation that I drove the switchbacks from Sacramento Airport to Napa to attend MSEC 2018 at the Silverado, October 28-30, 2018. Wh... »
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled out their shiniest bells and whistles. Here’s a sampling of news and products that were on display at IWLCP 2018, October 23-25, 2018 at the Doubletree Hotel in San Jose. Indium Corporation... »
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s Tien Wu during his IMAPS Symposium keynote earlier this month: High-performance applications like artificial intelligence (AI), 5G, autonomous driving, and even high-end smartphones are driving the continuation of Moore’s Law augmented by More than Moore. This need for high-performan... »
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the semiconductor industry. With exciting markets like artificial intelligence (AI), 5G, and the internet of things (IoT) technologies moving from ideas to implementation, this previously tired segment of the semiconductor industry is poised for action and faces abundant opportunities. “The s... »
Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with growing public awareness and concern about how their data is being used and shared. It’s become a challenge particularly in Europe, where urban designs lend themselves well to smart city concepts, yet the region’s dedication to protecting citizen data is of paramount impo... »
Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites as contributing editor and as a member of our esteemed technical advisory board. Like me, you may have noticed a pause in Phil’s missives on all things advanced packaging. While it’s only been a month or so since he penned his last post for Solid State Technology, it has already left a void... »
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