Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
What a week! From keynotes, panel discussions, and podcast interviews, to booth parties and after-hours networking – the week at SEMICON Europa was all about making connections. For us, that meant hosting our first-ever 3D InCites member social event on Monday, November 14 at the iconic Augustiner Keller. Guests from...
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the spirit of community this organization has cultivated over the years. It’s one of the reasons there is so much synergy between IMAPS and 3D InCites, and why we have become...
Are you listening to the 3D InCites podcast yet? We had a busy summer! Our listenership grew, and we achieved a significant milestone of over 5500 downloads since we first began our podcast journey just over a year ago. Not only that but we were excited to see we’re reaching...
On Tuesday, August 9th, President Biden sat down at a table on the White House Lawn for the highly anticipated signing of the CHIPS and Science Act of 2022. With the stroke of his pen, President Biden released public investments including 52.7 billion appropriations for semiconductor incentives; a new 25%...
I usually leave this sort of commentary to Phil Garrou and Dean Freeman. But after a year of debate and revisions, the CHIPS and Science Act (Formerly the CHIPS Act), has made it to President Biden’s desk, and who knows, by the time you read this, he may have signed...
Is it over already? SEMICON West 2022 flew by, true to form. My week was filled with keynotes and conversations with many movers and shakers in the semiconductor industry and beyond. Here are my initial observations and takeaways, with lots more to come in our upcoming podcast episodes. It’s a...
In a recent podcast episode, I interviewed Tom Smelker, of Mercury Microsystems, about the company’s role in providing safe and secure advanced packaging technologies for the UD DoD, as part of the SHIP program. SHIP stands for State-of-the-Art Heterogeneous Integrated Packaging. The company just opened a new facility in Phoenix...
As I listened to keynote speakers and panelists at the recent 2022 IMAPS Advanced SiP Conference talk about the commercialization of chiplet technologies, I felt a sense of déjà vu. The key takeaways of the talks and panel discussions sounded eerily familiar. And then it hit me: these were the...
I’ve started so many event blog posts since the return of live events with the phrase – it’s good to be back! But it bears repeating. And with ECTC 2022 weighing in with record attendance at about 2000 attendees, it’s clear that we are all pretty much done with virtual...
