Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
I’ve started so many event blog posts since the return of live events with the phrase – it’s good to be back! But it bears repeating. And with ECTC 2022 weighing in with record attendance at about 2000 attendees, it’s clear that we are all pretty much done with virtual...
The semiconductor industry is on a rapid growth trajectory, with a goal of becoming a $1 trillion industry by 2030 – that’s only 8 years away! Getting there will require a tremendous amount of innovation, investment, and risk-taking – all characteristics that define an entrepreneur. But what does it really...
Apple announced that it’s launching the new M1 Ultra processor for high-end Macs during its ‘Peek Performance’ event in March and announced the mysterious “UltraFusion” as Apple’s “custom-built packaging architecture.” Let’s take a closer look! Is Apple M1 using TSMC CoWoS technology? The Apple M1 Ultra is currently only available...
A Conversation with KLA’s Lena Nicolaides 2021 was a big year for the semiconductor industry, and 2022 is expected to be even bigger. Ironically, despite the mayhem it caused, the chip shortage and its impact on the global supply chain turned out to be the best advertising we could have...
Everyone in the semiconductor industry knows that if you want to be where the action is in January, SEMI Industry Strategy Symposium at the Ritz Carlton in Half-Moon Bay is the place to be. Except for this year. This year, thanks to Omicron, we had to wait until April to...
We are pleased to announce that thanks to the support of our industry partner, the International Microelectronics and Packaging Society; and the generosity of all our sponsors for the 2022 3D InCites Awards, our annual Mural Project, and the First Annual Hike for DEI; we raised $25,000 for the 3D...
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS Device Packaging Conference (IMAPS DPC). With over 400 attendees, it felt like the good old days. While it wasn’t the first in-person conference we’d attended; it did feel more like...
I’m sitting here, flipping through memories of 2021 like it was a Rolodex, sorting through the highlights, lowlights, and Aha! moments to share with you in this 3D InCites Yearbook editorial. And then I realize I’m dating myself, because how many people under the age of 35 know what a...
It is my honor to announce the winners of the 2022 3D InCites Awards. With 51 nominees in 11 categories, we had more participation than ever, and the competition was fierce! Thank you to this year’s platinum sponsors, ASE Group, EV Group and KLA; our gold sponsors, Evatec and YES, and...
Get ready! The 2022 3D InCites Awards nominations are open! This year, we are excited to partner with the International Microelectronics and Packaging Society (IMAPs) to bring you the 2022 3D InCites Awards at the 2022 Device Packaging Conference, March 7-10, 2022. Thanks to this year’s Platinum Sponsors, ASE Group,...
