SEMI has organized a 3D IC program during SEMICON Japan beginning with the 3D IC Summit on Thursday. The theme is “The Key to a Quantum Leap”, which will focus on the expectation for mass production of 3D ICs, and features executive speakers from Toshiba, ASE, Hitachi, and imec.
On Friday, from 12:30-2:20, a session titled Proposals to the Assembly Technologies to Drive 3D-IC gives equipment and materials suppliers the opportunity to make proposals about which processes will achieve the highest yields at the lowest cost. The session kicks off with an update on SEMI’s standards activities, followed by a Yole Developpment market update, and then will segue into suggestions for temporary bond/debond processes, assembly processes, underfill materials, wafer bonders, transport challenges, and a summary. Speakers represent Semi, iNemi, Yole, EV Group, Dow Corning, Shinkawa, Shin-Etsu, and Nagase ChemteX.
From 3-4:30 on Friday, Silicon Saxony will host its technology symposium. The 3D integration features 3D InCites own technical advisory board member, Juergen Wolf, who will give an update on activities at Fraunhofer IZM-ASSID.
