Driven by generative AI and HPC, cutting-edge package architectures present new challenges requiring new material solutions
Artificial intelligence (AI) and high-performance computing (HPC) are driving the need for higher-density, higher-performance package solutions. Because of this, advanced packaging revenues are set to grow at over 10% year-over-year through 2029, with high-density fan-out (HD-FO)/2.5D and 3D IC packages expected to realize 23% CAGR over the next five years.
These devices’ cutting-edge architectures pose significant packaging challenges and require innovative materials as part of the solution. Stress and warpage control are critical for large die, large body package functionality and performance. Henkel, a leader in advanced packaging materials development, has brought to market several new formulations designed to enable complex processor designs propelling tremendous computing capability.
Join our Expert Talk to learn more about advanced packaging market trends and how novel formulations from Henkel are helping enable device innovation. The presentation will cover:
- Market characteristics and package designs fueling AI and HPC growth, and how heterogeneous integration is making new packages more cost-effective and powerful
- Anhydride-free, low warpage liquid compression molding underfill (LC-MUF) for fine-gap filling and low wafer-level warpage
- High fracture toughness, low CTE capillary underfills for faster flow and thorough bump encapsulation on large dies
- Low-stress, high-elongation lid attach materials for improved warpage control and enhanced reliability performance
Technology experts from analyst YOLE Group will join the Henkel team for this informative discussion.
Gabriela Pereira is a Technology & Market Analyst in semiconductor packaging at Yole Group. Working within the Manufacturing & Global Supply Chain activities at Yole Group, Gabriela focuses on advanced packaging platforms, develops technology & market reports, and is engaged in dedicated custom projects. Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as an R&D Engineer, where she collaborated on several package development projects. Gabriela holds a master’s degree in metallurgical and materials engineering from the University of Porto, Portugal.
Raj Peddi is the Market Strategy Manager for Henkel’s Semiconductor Packaging Electronics business. In his long tenure at the company, Raj has held roles in technical customer service, engineering, and marketing. He has more than 25 years of experience in semiconductor packaging and electronic materials and has previously worked for other well-known industry leaders, including Honeywell and Motorola. Raj holds a master’s degree in chemical engineering from the University of Illinois Chicago and an MBA from Pepperdine Graziadio School of Business and Management. He is based in Henkel’s Irvine, California facility.
Kail Shim is the Application Engineering Manager for Henkel’s Semiconductor Advanced Packaging Electronics business. He has more than 22 years of experience in semiconductor packaging and electronic materials and has been involved in many semiconductor packaging materials development like TC NCP, NCF, Capillary underfill, liquid compression mold and lid attach material during his long tenure at the company. he holds a bachelor’s degree in Semiconductor engineering from the InHa University in Korea. He is based in Henkel’s Irvine, California facility.
