IRSP 2019

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Date(s) - 11/04/2019 - 11/06/2019
12:00 am

San Jose State University


After 25 years, IRSP 2019 (former “Stress workshop”) is coming back to Silicon Valley, held at San Jose State University on November 4-6.

This meeting, in addition to traditionally covered stress and thermal issues at the level of materials and devices, will be dealing with reliability & performance problems at higher levels – circuits, chips, products. As usual, a serious attention will be paid to the stress and thermal effects in advanced packaging, heterogeneous integration, and chip-package interaction. This year conference will provide a forum for direct interaction between experts from the field of materials/device reliability and from the design-for-reliability community addressing the same problems.

Learn more at the conference website , which provides additional info including the list of keynote and invited presentations and a call for papers.