IMAPS DPC 2024 Makes Advanced Packaging Fun Again!
Mar 26, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 32
Breaking News from Global Business Council
I promised that as soon as I knew who NEXX’s new collaboration was with, I would let you all know....Collaborate, innovate, and get ready for the rebound
I know where many of the optimistic people in the semiconductor industry were today; giving presentations at the Global Business...The Other 3D Packaging Technologies
While TSV developments continue to attract media attention as the rock star technology of 3D integration, it’s important to remember...Was Moore’s Law really meant to be a law or more of a guideline?
Before I joined the semiconductor industry, I was completely unaware of this guy Gordon Moore, whose observations and predictions set...Following the BrightSpots 3D IC Forum
Day One: I'm not sure if it’s because it was the Monday after a U.S. holiday weekend, or just...
3D InCites: Unveiled
Today, July 6, 2009, is the day a vision becomes a reality. When I first started Françoise in...More about UBM for conformal TSVs
In response to the previous post, Bob Patti of Tezzaron Semiconductors weighed in with a solution to performing under bump...TSV copper fill: is it necessary for UBM?
In response to a recent post about the whether/when it is necessary to completely fill TSVs, or sufficient to...June Events in 3D
As May rolls right into June, so do the 3D events; or should I say events in which 3D topics...“Francoise in 3D” resurfaces in AZ
For the past two weeks, I’ve been slightly preoccupied with relocating from Massachusetts to Arizona. For much of that time,...
A Visit to Nexx Systems
It’s easy to see why NEXX is experiencing growth. It’s all about attitude, and the enthusiasm among NEXX’s team...
A Visit to SUSS MicroTec
It’s been...
