Roland Rettenmeier

About Roland

Roland Rettenmeier is a seasoned Sales and Business Development expert in Advanced Packaging with 25+ years of experience across PCB, IC substrates, Wafer-Level, and Panel-Level packaging.

After qualifying as a Mechanical Engineer in 1997, he started his career at AT&S AG, where he worked in various departments. In 2005, he completed his MBA in Vienna and continued expanding his expertise through programs like Six Sigma (AT&S, Nokia) and executive education at Stanford University.

Over his 25-year career, Roland built a solid track record in leading high-performance teams and delivering consistent revenue growth in the Advanced Packaging Industry.

In March 2025, Roland joined SCHMID Group as CSO and works with the global sales organization on current and future opportunities.

Roland also plays a key role in the industry as Committee Member and Session Chair of the SEMI Advanced Packaging Conference in Europe and Advisory Board Member of the International Semiconductor Industry Group.

With his deep industry knowledge and global network, Roland remains at the forefront of semiconductor packaging innovation.