Francoise News
Passing the Torch: Reflections from SEMICON Europa 2025
While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full...
Francoise Unfiltered: Thoughts from IMAPS Symposium and SEMICON West
Maybe it’s my impending retirement, but I’m feeling a little salty these days. This my fifth draft about the highlights,...
Changes at 3D InCites: Here’s What You Need to Know
I recently realized that IMAPS Symposium 2025 marks my 20th anniversary in the microelectronics industry. It was the first industry...
IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help...
ECTC 2025 Celebrates Seventy-five Years of Pushing the Connectivity Scale
Seventy-five years is a long time. Fireworks often light up the sky to celebrate such significant milestones. How fitting it...
Arizona: The Epicenter of Semiconductor Resurgence
Whether we start calling it Chip Canyon, the Silicon Zone, or Silicon Diyógí (say Dare-yo-ghee), it looks like Arizona is...
A Tribute to Paul Werbaneth: Friend and Colleague
Earlier this month, in the middle of the IMAPS Device Packaging Conference Welcome Reception, I got an upsetting text from...
Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging 2025
There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites...
SEMICON Korea 2025 Member Preview: Lead the Edge
In its continued focus on AI and smart devices, SEMI’s theme for this SEMICON Korea 2025 is “Lead the Edge”. ...
Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb...
The 3D InCites Podcast Backtrack – 2024 in Review
Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It...
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the...
Making Connections at SEMICON Europa 2024
Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations...
Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a...
2025 IEEE Electronic Components and Technology Conference Announces Student Competition
Student Competition Proposals Must be Submitted by November 30, 2024 The IEEE Electronic Components and Technology Conference (ECTC), the premier...
2024 IEEE International Electron Devices Meeting Spotlights Advances in Critical Semiconductor Technologies
Shaping Tomorrow’s Semiconductor Technology Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the...
Leaning Into Interconnectology – Musings from IMAPS Symposium 2024
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston...
