The 3D InCites platform operates under the IMAPS umbrella, delivering a technology and innovation spotlight for engineers, researchers, manufacturers, and students across the microelectronics and advanced packaging sectors. Content and media covers a variety of leading technologies, including device and chiplet packaging, advanced thermal solutions, AI driven packaging, 3D integration, heterogeneous integration, photonics/CPO, and next‑generation materials, to name a few.
IMAPS purchased the 3D InCites platform in January 2026 from 3D InCites LLC (created and managed by Francoise von Trapp). These longstanding industry resources are now part of the IMAPS portfolio and will continue as an important technical and media platform for the advanced packaging industry.
About IMAPS
IMAPS is the premier, non-profit membership association steering the communities associated with Microelectronics Advanced Packaging, Interconnect and Assembly by providing channels for communicating, educating, and interacting within academia, industry and government. IMAPS leads the advancement and growth of the advanced packaging workforce through professional education, upskilling, and networking across the entire semiconductor supply chain, both in-person via conferences and on-site training, as well as on-demand through the new IMAPS Academy software portal.
Contact Us
IMAPS, International Microelectronics Assembly and Packaging Society
PO Box 14727
Pittsburgh PA 15234
