IMAPS Symposium Member Preview 2025

The IMAPS Symposium is just around the corner! Taking place from September 29 through October 2 at the Town & Country Resort in San Diego, California, this year’s event will emphasize advanced packaging structures, advanced interconnects, bumping and wire bond technologies, MEMS and sensors, RF, and more. 

With 18 of our members presenting, 20 exhibiting, and Francoise podcasting in booth 801, the 2025 event will be one to remember. You also won’t want to miss the Wednesday evening panel session – Building the Ecosystem for Co-Packaged Optics – featuring Tolga Tekin from Fraunhofer IZM, John Knickerbocker from IBM, and moderated by Jan Vardaman from TechSearch International. 

IMAPS Symposium will also feature a full day of Professional Development Courses (PDCs) on Monday, Sept. 29. With 18 courses to choose from, including two from Fraunhofer IZM and one from Kulicke & Soffa, there’s a course for everyone. Event registration is open, and rates will increase on Sept. 17. 

If you’re a member company and you don’t see your session on the list, please reach out to me at jmc@3dincites.com.  

Amkor 

Innovative OBGA Packaging Solutions for High-Reliability Automotive Optical Sensors 

• Tuesday, Sept. 30 from 1:15-1:40 p.m. 
• Weilung Lu, Adrian Arcedera 

Module Stress Correlation for 2.5D TSV-Based Heterogeneous Package with Underfill and Metal Lid Adhesive 

• Tuesday, Sept. 30 from 1:15-1:40 p.m. 
• Hoon Jung, Quan Pham, Bryce Lukehart, Haamid Juvale, JunOh Bong, MinKeon Lee, HyungSang Park

ASE

Electromigration Challenges in FCQFN Packaging: Impact of Solder Thickness and Shape on Reliability 

• Tuesday, Sept. 30 from 2-3:10 p.m. 
• Min-Yan Tsai, Shan-Bo Wang, Yung-Sheng Lin, Christophe Zinck, Chen-Chao Wang, Chih-Pin Hung

Optimizing Electroplating Uniformity in Advanced Packaging: Breakthroughs with Global/Local Simulation Approach 

• Tuesday, Sept. 30 from 5-5:40 p.m. 
• Yi-Lun Hung, Mingtzung Kuo, Ling-Yuan Chang, Min-Yan Tsai, Yung-Shen Lin, Chen-Chao Wang, Ping-Feng Yang, Chin-Pin Hung

EV Group 

Innovative Digital Patterning by LITHSCALE XT for UHD FO WLP and HD PLP Required in 3D Integration 

• Thursday, Oct. 2 from 9:30-9:55 a.m. 
• Ksenija Varga, Roman Holly, Tobias Zenger Matthias Brunnbauer, Thomas Uhrmann

Finetech

Indium Bump Interconnect (IBI) Flip Chip Bonding 

• Wednesday, Oct. 1 from 12-12:25 p.m. 
• Travis Scott 

Fraunhofer IZM 

PDC 1: Fundamentals of Substrates for High-Frequency Packaging and Heterogeneous Integration

• Monday, Sept. 29 from 8-10 a.m. 
• Ivan Ndip

PDC 10: Harnessing Photonic Interconnects: A Comprehensive Course on Co-Packaged Optics (CPO) for High-Performance Systems 

• Monday, Sept. 29 from 10:30 a.m. – 12:30 p.m. 
• Tolga Tekin

Jet Dispensing Process Development for a Novel Nano-Ag-Sinterpaste for Pressureless Sintering of Minaturized Opto-Electronic Components 

• Tuesday, Sept. 30 from 1:15-1:40 p.m. 
• Linus Daniel Stier, Mathias Koch, Karl-Friedrich Becker, Tanja Braun 

STX-MOD-HPC Package for an AI Application

• Wednesday, Oct. 1 from 10-10:25 a.m. 
• Karl-F. Becker, Michael Schiffer

An Orthotropic Viscoelastic Model of Woven Glass/Epoxy Composite for Printed Circuit Board Applications Based on Simple Experimental Techniques and Reverse Engineering 

• Wednesday, Oct. 1 from 11:30-11:55 a.m. 
• Marius van Dijk, Olaf Wittler

Cavity-Backed Antennas Using Quartz Glass on Silicon Hybrid Bonded Wafers for Sub-THz Communication and Radar Applications 

• Wednesday, Oct. 1 from 2-2:25 p.m. 
• Uwe Mass, Wojciech Partyka, Alexander Gabler

Integration of a High-Efficiency DC-DC Converter in a Next-Generation Ultra-High-Resolution Seismic Streamer for Offshore Subsurface Mapping 

• Wednesday, Oct. 1 from 4-4:25 
• Dincer Sirkeci 

Panel Session: Building the Ecosystem for Co-Packaged Optics 

• Wednesday, Oct. 1 from 6:45-8 p.m. 
• Tolga Tekin

FOWLP for Next-Generation Optical Switches: Scalable Packaging Solutions for Photonic-Electronic integration 

• Thursday, Oct. 2 from 11-11:25 
• Marius Adler, Robert Gernhardt, Tanja Braun, Markus Wohrmann

Henkel 

Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction in Image Sensor Packaging 

• Tuesday, Sept. 30 from 2-3:10 p.m. 
• Ning Liu, Shahram Seyedmohammadi, Howard Yun, Matthew Tsai

IBM 

Interconnect Modeling: From Atom to System 

• Wednesday, Oct. 1 from 12-12:25 p.m. 
• Nick Lanzillo

Panel Session: Building the Ecosystem for Co-Packaged Optics 

• Wednesday, Oct. 1 from 6:45-8 p.m. 
• John Knickerbocker

Challenges and Solutions in Organic Substrate-Based Chiplet Packaging: High Density Organic Interposer and Si Bridge 

• Thursday, Oct. 2 from 11:30-11:55 a.m. 
• Toyohiro Aoki

Indium 

Reflow and Reliability of In-Ag Soldering Thermal Interface Material With and Without Flux for TIM1 and TIM1.5 Applications 

• Wednesday, Oct. 1 from 9:30-9:55 a.m. 
• Noah Smith, Jie Geng 

Liquid Metal Paste Dispensing as a Thermal Interface Material for High-Performance Computing Applications 

• Wednesday, Oct. 1 from 10-10:25 a.m. 
• Milos Lazic, Ricky McDonough, Bob Jarrett

Gallium Phase Change Metal Thermal Interface Material (TIM) 

• Wednesday, Oct. 1 from 10:30-10:55 a.m. 
• Milos Lazic, Ricky McDonough, Bob Jarrett 

Kulicke & Soffa

PDC 9: Wire Bond Physics & Process Optimization 

• Monday, Sept. 29 from 10:30 a.m. – 12:30 p.m. 
• Henri Seppanen 

LPKF

Enabling High-Volume Manufacturing (HVM) of Glass Substrates for Advanced Packaging Through LIDE and Advanced Metrology 

• Thursday, Oct. 2 from 9:30-9:55 a.m.
• Richard Noack, Jannis Heinz

LQDX

Sub-Micron Patterning & High Aspect Ratio Structures in Advanced Substrates with Dry Etching and Liquid Metal Ink Metallization 

• Tuesday, Sept. 30 from 3:45-4:10 p.m. 
• Simon McElrea, Sunity Sharma

Low-Temperature Ink Metalization of Glass Core Substrates and High-Aspect Ratio Through Glass Vias 

• Wednesday, Oct. 1 from 2:30-2:55 
• Simon McElrea, Sunity Sharma, Sharon Yeh, Sue Kao

MacDermid Alpha 

Developing a Non-Cyanide Gold Bath Free of Heavy Metals for Via-Fill Applications 

• Tuesday, Sept. 30 from 4:40-5:10 p.m. 
• Dolores Ross, Veronica Lambert, Harshul Khanna, Adam Letize, Robert Chainey, Brian Gokey, Thomas Richardson, Elie Najjar

PFAS Free, High Reliability and Multisurface Die Attach for QFN Packages 

• Thursday, Oct. 2 from 10-10:25 
• Avin Dhoble, Senthil Kanagavel, Elisia Siow, Tim Kuo

Onto Innovation

Enabling High-Volume Manufacturing (HVM) of Glass Substrates for Advanced Packaging Through LIDE and Advanced Metrology 

• Thursday, Oct. 2 from 9:30-9:55 a.m.
• Burhan Ali, Monita Pau 

PulseForge

Photonic Curing and Soldering of Printed Metal Ink Interconnects to Advance Additively Manufactured Electronics Integration and Packaging 

• Tuesday, Sept. 30 from 2-2:40 p.m. 
• Harry Chou, Ogadimma John Okwuoma, Ian Rawson, Vahid Akhavan, Ara Parsekian 

Saras Micro Devices

Saras eVR STile – Demonstration of Next Generation Integrated Passives for Next Generation AI & HPC Power Delivery Network Designs 

• Wednesday, Oct. 1 from 2-2:25 p.m. 
• Bartlet DeProspo, Eelco Bergman 

Siemens 

Using UCIe Channel Compliance Simulation for Understanding Substrate/Interposer Design Tradeoffs 

• Wednesday, October 1 from 1:30-1:55 p.m. 
• Matthew Leslie, Randy Wolff, John Caka 

Syenta 

Syenta Introduces Localized Electrochemical Modeling (LEM). Combining Localized Electrodeposition with Micron-Resolution Stamp-Based Patterning to Enable Precise, Additive Fabrication 

• Wednesday, Oct. 1 from 2:30-2:55
• Jekaterina Viktorova

TechSearch International 

Panel Session: Building the Ecosystem for Co-Packaged Optics 

• Wednesday, Oct. 1 from 6:45-8 p.m. 
• Moderated by Jan Vardaman 

Member Exhibits