JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies.
JOINT3 brings together global leaders in semiconductor materials, equipment, and design. Using a prototype line for 515 x 510-mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic interposers.
“At Brewer Science, our participation in the JOINT3 Consortium reflects our continued commitment to driving innovation in the semiconductor industry,” states Dr. Srikanth (Sri) Kommu, co-CEO at Brewer Science. “Leveraging our advanced materials expertise—particularly in high-performance polymer solutions—we collaborate with industry leaders to pioneer technologies that enable smarter, more sustainable solutions. Through this consortium, we aim to accelerate the development of next-generation semiconductor packaging, supporting a connected, intelligent, and environmentally responsible future.”
In recent years, packaging technologies in the back-end process have become one of the key technologies for next-generation semiconductors, which are essential for rapidly expanding markets such as generative AI and autonomous driving. Among these technologies, 2.xD packages, which involve arranging multiple semiconductor chips in parallel and connecting them via an interposer, are expected to see further growth in demand due to the increasing data communication capacity and speed requirements. As semiconductor performance improves, interposers are becoming larger in size, and there is a shift from silicon interposers to organic interposers made from organic materials. Regarding manufacturing methods, the conventional approach involves cutting rectangular pieces from circular wafers. However, as interposers increase in size, the number of interposers that can be obtained from a single wafer decreases, posing a significant challenge. To address this issue, a manufacturing process that transitions from circular wafer shapes to square panel shapes is gaining attention, as it allows for an increased number of interposers to be
produced.
