Silver Sponsors:
Nominations Starts on January 19, 2023!
Submit your 2023 3D InCites Awards nomination to recognize excellence in heterogeneous integration.
3D InCites Awards nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.
This year, we are also accepting online nominations for companies that demonstrate best practices in sustainable semiconductor manufacturing, and diversity equity and inclusion (DEI). These companies will be considered as candidates for the 3D InCites Sustainability Award and the SemiSister Award for DEI, respectively.
Winners of the Technology Awards are selected by a panel of five judges: four are industry experts and the fifth judge is YOU, the 3D InCites Community, via the online ballot. Winners of the Sustainability and SemiSister Award for DEI will be selected by special committees.
Important Dates:
- Accepting Applications: September 16-October 18, 2024
- Finalists Notified: November 16, 2024
- Finalists Announced: January 8, 2025
- Awards Presented: March 4, 2025
Please come back soon
Learn more about the awards
There is no fee for submitting a 2022 3D InCites Awards nomination, but we welcome donations to the 3D InCites DEI Fund for woman- or URM-owned technology businesses.
