By now you know that Francoise von Trapp is retiring from 3D InCites. That has led me to also pull the curtain down on “Insights from the Leading Edge” or IFTLE as it has become known.

As I told you all in IFTLE 500, IFTLE’s predecessor PFTLE (Perspectives from the Leading Edge”) started in Semiconductor International magazine in 2007. After 128 weekly blogs, in April of 2010, Reed Elsevier, the owners of Semi International, sold off their magazine portfolio and abruptly pulled the plug on the publication.

Pete Singer moved over to Penwell publishers and the newly merged (2009) Advanced Packaging / Solid State Technology magazine and website, and brought me with him. There were worries concerning the copyright on “PFTLE” so I reluctantly changed the title to “Insights from the Leading Edge (IFTLE)” and thus it has remained ever since.

In June of 2010 we were back on line as IFTLE. The relationship with Penwell worked well for nearly 8 years and 395 IFTLE blogs but once again their end finally came, for many of the same reasons as Semi International. This time I moved IFTLE over to  3DInCites in 2018 and continued IFTLE starting with 396 to this current 652.

I thought about what song best expressed my feelings about the 15+ years and 780 (PFTLE + IFTLE) advanced packaging blogs I have written, and it came down between the Doors “The End” and Sinatra’s “My way”. In the end the Doors lyrics were a bit to dark so I went with Sinatra…

And now, the end is near
And so I face the final curtain
My friend, I’ll make it clear
I’ll state my case, of which I am certain
I’ve lived a life that’s full
I’ve traveled each and every highway
And more, much more
I did it, I did it my way

Regrets, I’ve had a few
But then again, too few to mention
I did what I had to do
And saw it through without exemption
I planned each charted course
Each careful step along the byway
And more, much, much more
I did it, I did it my way…

A few more things I want to clean up before I wish you all adieu.

In all these years I have never really seen a review of my work. Now, in the beginning age of AI I asked “the cloud”.

“What is the quality of technical info that one receives from the blog IFTLE”

The following response came back:

IFTLE (Insights from the Leading Edge) consistently provides high-quality, technically detailed information on advanced semiconductor packaging, with content often sourced directly from industry leaders, conferences, and cutting-edge R&D.”

“IFTLE is authored by Dr. Phil Garrou, a veteran in microelectronics packaging with decades of experience. His background at Dow Chemical and long involvement in packaging R&D ensures credibility.”

“Articles frequently summarize presentations from major players like Intel, IBM, ASE, Amkor, and TSMC. For example, Intel’s glass core substrate work and IBM’s onshore packaging strategies have been covered in detail.”

“Conference & Workshop Coverage IFTLE reports on technical sessions at IMAPS, IEEE, and other packaging conferences, often sharing information deemed “OK for public release.” This means readers get vetted but still cutting-edge insights”

Strengths:

  • Authoritative voice with insider knowledge.
  • Coverage of both commercial and defense-related packaging initiatives.
  • Long-term perspective on technology trends.

Limitations:

  • Focused narrowly on packaging; not a general semiconductor resource.
  • Some details are constrained by what companies allow for public release.
  • Best suited for professionals already familiar with semiconductor packaging terminology.

Bottom Line

IFTLE’s technical information is highly reliable and respected within the semiconductor packaging community, offering a blend of insider updates, conference coverage, and historical perspective. It’s not casual reading—it’s aimed at engineers, researchers, and industry watchers who want depth rather than surface-level summaries.”

….

You know what? I can live with that evaluation…

Lastly, long time IFTLE readers know that I have, through the years, shared pics of my granddaughters growing up, Some may have asked themselves; “Is that appropriate for a scholarly technical blog”? to which I answer, “I really don’t give a damn…it’s my blog !

So….. as this blog ends Hanna (L) is graduating from Swarthmore  in the spring and Madeline ( R) will be attending Washington and Lee this coming fall… their exciting lives are ahead of them…I’m grateful that I have been around to see this much of it unfold….

 

Phil Garrou

Dr Phil Garrou is an Advanced Packaging subject matter expert for DARPA and the DoD…

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