Finalists for SEMI’s Startups for Sustainable Semiconductors (S3) program pitched their solutions at SEMICON West. As in previous years, most of these are either aimed at front-end processes or are more generally applicable to many industries (e.g., wastewater treatment). However, a handful of finalists since 2022 have developed products that are relevant to 3D integration.
Boston Materials (2024)
Boston Materials produces thermal interface materials (TIMs) designed for direct-to-chip cooling of high-power devices. Typical TIMs are either thermal greases, solders, or metal alloys that are liquid at room temperature. Boston Materials introduced a new class of materials to the mix by creating a composite of carbon fiber and liquid metal.
Experiments on test vehicles show improved cooling compared to thermal grease. The company’s technical brief notes that it is possible to achieve similar cooling with lower water flow rate. That means lower water consumption and reduced leak risk.
The company received $13.5 million in venture capital funding in late 2024, which it is using to expand into the semiconductor market.
Arieca (2025)
Arieca proposes a different approach to thermal management. It embeds liquid metal droplets in a polymer base to achieve better adhesion and high reliability under harsh conditions. The promise is similar thermal performance to liquid metal TIMs with improved reliability and a simpler manufacturing process.
Target applications include data center cooling, power ICs for automotive, and, notably, chiplet designs for high-performance computing.
Syenta (2025)
Syenta, a 3D inCites community member, has developed a new interconnect technology aimed at AI computing. Its electrochemical method deposits and patterns copper in a single step, speeding up productivity. The technology, which is designed for the compute/memory interface, can create redistribution layers (RDLs) with a 1 µm line and space on large packages.
Syenta is one of the startups participating in the 2024-25 cohort of Applied Materials’ Applied Startup Technology & Research Accelerator (ASTRA).
XLYNX Materials (2025)
XLYNX Materials creates PFAS-free additives that enable cross-linking or improve adhesion of conventional polymers, expanding applications for those materials. The company claims that its additives can crosslink nearly any polymer, including those that are otherwise uncurable. Example applications include novel low dielectric constant underfills, stronger molding compounds, or adhesives with optimized coefficients of thermal expansion (CTE).
What’s surprising is that XLYNX Materials’ crosslinking technology was initially developed for the textile industry. While the company still mentions textile applications, semiconductor packaging has turned out to be a good fit.
Materials of the Future?
Whether the companies mentioned achieve widespread adoption remains to be seen. Still, I find it encouraging that startups are launching materials that aim to improve efficiency, reduce process steps, or replace harmful compounds. Our industry faces tremendous hurdles when it comes to improving sustainability. The more choices OEMs have in choosing materials and processes, the better. I look forward to following the innovative materials-focused startups and seeing where they go.
