MacDermid Alpha presents advanced packaging and power semiconductor materials at SEMICON Taiwan, highlighting reliability, sustainability, and expert insights at the TechXPOT forum.
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will showcase its advanced packaging solutions for next-generation semiconductor devices at the SEMICON Taiwan expo, Taipei, from September 10 to 12, booth #L1108. Meet our technical experts to discover materials engineered for peak performance and reliability, enabling next-generation semiconductor designs in demanding applications like 3D packaging and high-performance computing (HPC) for AI.
Join our Experts Tai-Chi Liu and Wenbo Shao at the TechXPOT Forum
Tao-Chi Liu, Ph.D., Sr. R&D Application Manager and Wenbo Shao, Ph.D., Sr. R&D Manager will present, Material Innovations for Reliable 3D Interconnects: Fine-Grain Cu for Hybrid Bonding and IMC-Free Barriers for Micro-Pillar Solder Joints, at the TechXPOT forum during the expo. As high-performance computing (HPC) and artificial intelligence (AI) continue to advance, the demand for faster, more reliable memory technologies is pushing the limits of traditional packaging methods. With shrinking node sizes and a shift toward vertical integration, 3D packaging is becoming the industry standard, but not without challenges. In their presentation Liu and Shao will introduce two breakthrough materials to address these challenges:
- Fine grain hybrid bonding technology – Exhibits excellent thermal stability, eliminates voiding, and enhances electromigration reliability.
- ReCo barrier material – Enables intermetallic compound free, highly reliable micro-pillar bumps.
These innovations mark a critical step forward in overcoming thermal and structural limitations in next-generation advanced packaging.
Enhance Interconnect Reliability
Discover metallization and wafer level packaging technologies that enable complex, high-density interconnect designs. MacDermid Alpha will showcase its award-winning NOVAFAB® Fine Grain Copper electroplating process, designed to address interconnect reliability challenges in advanced packaging architectures. Also featured: ViaForm® dual-damascene chemistries, designed to meet the precise demands of advanced-node manufacturing, delivering high-performance, void-free fills for complex interconnects.
Pioneering Sustainable Innovation
Learn how MacDermid Alpha’s advanced innovations enhance manufacturing processes while supporting sustainability initiatives. The Low Alpha Tin portfolio is designed to eliminate alpha particle emissions in critical semiconductor applications, combined with a vertically integrated supply chain, for high purity and sustainable sourcing. ATROX® Zero PFAS1 conductive die attach products are specifically developed to support high-reliability applications, while mitigating environmental and health risks.
Drive Performance in Advanced Applications
Explore solutions for power semiconductor devices and high-density packaging that deliver exceptional thermal and mechanical reliability. ALPHA® Argomax® sinter materials are specifically developed to enhance the longevity and efficiency of power electronics in demanding environments. Solder thermal interface materials (sTIMs) significantly improve heat dissipation, boosting device performance and extending operational lifetime.
Join our experts at booth L1108 and hear Dr. Liu and Dr. Shao at the TechXPOT forum. To register please visit: macdermidalpha.com
