Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
WS-910 Flip-Chip Flux is designed to provide best-in-class residue cleaning for a water-soluble flip-chip flux, allowing for excellent compatibility with molded and capillary underfill. The new product also offers high tackiness, which is useful when holding large die in place during the reflow process. WS-910 expands Indium Corporation’s extensive line of semiconductor assembly solutions, supporting advanced packaging and high-reliability applications.
Halogen-free WS-910 delivers several benefits to users, including:
- High tackiness minimizes non-wet open defects and “cold joints”
- Promotes excellent solderability onto a wide range of surfaces
- Ensures consistent yields through consistent dipping performance over extended periods
- Excellent cleaning with pure room-temperature deionized water
- Designed for Pb-free applications and suitable for all high-Sn solders
- Compatible with a wide variety of conventional ultrafiltration and modified ultrafiltration
Indium Corporation’s flip-chip flux series addresses common miniaturization challenges, including thin or warped substrates and fine-pitch, high I/O count assembly. The company offers fluxes in both water-soluble formulations and ultra-low residue no-clean options, which provide a sustainable, low-residue alternative to traditional water-soluble fluxes.
To learn more, visit https://www.indium.com/products/fluxes/semiconductor-fluxes/flip-chip-flux/.
