Calling All Semiconductor/Microelectronics Packaging Interns! – We want to know what your summer internship was like. Here’s your chance to get published! Submit 500 words and a photograph about your summer internship and we will publish it on 3D InCites. Is the company you’re interning for a 3D InCites Community Member or would they like to be? Editors will pick their three favorites from member companies to appear in the 2022 issue of 3D InCites Yearbook. Submit your entry to trine@3DinCites.com

Trine Pierik

Trine Pierik has been working in the field of marketing and communications for over 20…
Related Category Posts
The “White House of Microelectronics Packaging” Celebrates Its 15th Anniversary!
Feb 10, 2025
By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years...
US-JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders
Feb 05, 2025
As global semiconductor demand continues to surge, international collaboration has...
Empowering the Future: New York’s Semiconductor Industry Surge
Feb 03, 2025
In 2024, New York’s semiconductor industry experienced substantial growth, driven...
Related Tag Posts
IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ
Feb 12, 2025
CHIPS for America has announced three anticipated CHIPS for America...
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Feb 11, 2025
Heterogenous integration and AI are currently moving forward hand-in-hand as...
SEMICON Korea 2025 Member Preview: Lead the Edge
Feb 06, 2025
In its continued focus on AI and smart devices, SEMI’s...