Calling All Semiconductor/Microelectronics Packaging Interns! – We want to know what your summer internship was like. Here’s your chance to get published! Submit 500 words and a photograph about your summer internship and we will publish it on 3D InCites. Is the company you’re interning for a 3D InCites Community Member or would they like to be? Editors will pick their three favorites from member companies to appear in the 2022 issue of 3D InCites Yearbook. Submit your entry to trine@3DinCites.com

Trine Pierik

Trine Pierik has been working in the field of marketing and communications for over 20…
Related Category Posts
Reflections on My Year as the 3D InCites Editorial Intern
Dec 10, 2025
Over the past year, my role as the 3D InCites...
November Member News: Shaping the Future of Semiconductors
Dec 02, 2025
November was a dynamic month for the 3D InCites community and...
From Reactive to Proactive: Semiconductor Shipment Visibility in 2025 and Beyond
Nov 17, 2025
In 2024, electronics cargo theft, including semiconductors, servers, and high-end...
Related Tag Posts
Is Copper Sintering the Key to Advancing Wide Band Gap Semiconductors?
Dec 09, 2025
By Rejoy Surendran and Xinpei Cao, Henkel Adhesive Technologies In...
IFTLE 649: Let the Hybrid Bonding Wars Begin! Also: Samsung Locks in Glass Interposer Source
Dec 08, 2025
Adeia vs AMD Hybrid bonding is a semiconductor packaging technique...
The EU’s Semiconductor Strategy: CHIPS Act 2.0, Investments, and More
Dec 03, 2025
I recently attended SEMICON Europa in Germany to learn how...









