Archives December 2017 - 3D InCites

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9 temblor near Alum Rock I thought could have been my neighbor dropping something heavy in the apartment upstairs, except that nobody lifts and drops anything that heavy, for that long, in the building where I live. No reports of damage, but the shaking came... »

Holiday Greetings from 3D InCites!

Holiday Greetings from 3D InCites!

Did you ever wonder how much easier Christmas Eve would be for Santa in a world enabled by heterogeneous integration? This video shows our vision. Enjoy! Warm wishes for a Merry Christmas and Happy New Year from your friends at 3D InCites! »

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

  EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its industry-leading process equipment. The building, part of an investment of more than 20 million Euros th... »

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed at the university’s Takagi & Takenaka Laboratory, the EVG810LT augments the laboratory’s research f... »

Trymax and AST China Partner to Distribute and Support Customers in China

Trymax and AST China Partner to Distribute and Support Customers in China

NIJMEGEN, The Netherlands and Beijing, China (Oct. 10, 2017) – Trymax Semiconductor Equipment BV and AST China announced today that they have entered into a distribution and service agreement for China focusing on the institutes. The agreement is a direct consequence of increased customer activity and business for Trymax in China. AST China will act as a sales and support office for Trymax c... »

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest. Last week at 3D ASIP 2017, my suspicions were confirmed, when it was revealed by Dan Green, DARPA, that if the powers that be had bothered reading to the top of Page 3 of Gordon Moore’s “Crammi... »

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration tech... »

Electromagnetic Simulation for Electronic Systems

Electromagnetic Simulation for Electronic Systems

Packages and boards are playing an increasing role as a way to increase speed and density while reducing power and form factor of electronic systems. This is part of a trend called sometimes “more than Moore”, to refer to factors in addition to scaling ICs. Packages and boards both represent sizeable industries, even compared to the $300 billion semiconductor industry. Packaging is estimated t... »