The InStrip3D utilizes the experience gained from a well-established installed base of high-parallel InStrip/InMEMS solutions. The architecture of the InStrip allows the configuration of the system to meet the special requirements of partial stack test with respect to the extremely sensitive bare dies.
Multitest is the first equipment supplier to deliver a full turn-key hardware set up for in-process test in 3D assembly. The company’s unique product portfolio enables Multitest to partner with customers to develop comprehensive solutions for this emerging packaging technology, which is a major strategic initiative in the semiconductor industry. The integrated test solution uses a Multitest load board, leveraging the industry-leading fabrication capabilities for fine-pitch, high layer count PCBs to support this 0.4 mm pitch array application in a high pin count multi-site configuration. In close cooperation with the customer, the mechanics of the test were redesigned to accommodate the increased forces from the highly dense pogo array of approximately 6000 pins.