The SMTA, in conjunction with Chip Scale Review magazine, is pleased to announce the program for our 6th Annual International Wafer-Level Packaging Conference (IWLPC). Full details on the technical sessions, panel discussions and special events can be found at:

Tabletop exhibit space is still available. Don’t miss this opportunity to share your product and services with your industry colleagues. Exhibit space sold out last year, so register early.

Download load complete flyer here.

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