Archives March 2009 - 3D InCites

Alchimer: A Growing Concept

In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists are working diligently to prove the readiness of an elegant and innovative electrochemical-based process for the growth of nanometric thin films of various types on both conducting and semiconducting surfaces. The technology has the potential to revolutionize proc... »

IWLPC 2009 speakers put 3D up front

Sure, 3D integration and packaging isn’t the only game in the semiconductor industry town, but even at events like last week's 2009 International Wafer-Level Packaging Conference (IWLPC), which covers the gamut of packaging technologies, 3D topics are the main attraction. Speakers and panelists pointed to 3D solutions at the wafer, package and system levels as elemental to the industry future. ... »

A funny thing happened on the way to IMAPS 2009

This is not a story about 3D integration technologies (although I’m sure I can figure out a way to work it in). This is about random acts of kindness, karma, and validation of my belief that most people in this world are decent and good. This morning, somewhere between the San Jose Airport and the convention center, I lost my cell phone. And the most disturbing thing about it was the feeling t... »

My 3D IC Blog-venture

While most of my blogging will be devoted to talking about what's happening in the world of 3D integration technologies, every once in a while you'll see a post devoted to the blog itself. It's where I explain to visitors, both returning and first-time, what my scope of coverage is, how to submit information for consideration, and tips on how to subscribe. I call it shameless self promotion. »