Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
Tezzaron’s multi-project wafer program: participant perspective
Tezzaron’s multi-project wafer program: participant perspectivesTo follow up with last week’s report on Tezzaron’s multi=project wafer program (MPW), I asked a few of the participants to share information about their part in the project, and the benefits of working in this paradigm. The first respondent was Donald Chiarulli, Professor...
Live from San Diego, it’s ECTC 2009
When I attend a conference like ECTC, packed with densely detailed technical presentations, I realize just how much work has to happen behind the scenes to bring all these technologies to production. The devil is clearly in the details.
News in 3D: the plot thickens at ECTC
Gossip flies at industry events. But usually as soon as someone tells me something juicy, they follow up with “but you can’t write about that yet.” Do you realize how hard that is? When, WHEN can I tell? Other times, I guess the answer, and can tell I’ve hit the...
Which comes first, 3D standards or market adoption?
The more I talk to people involved in bringing 3D integration using TSV to market, the more it’s clear that the standards issue is another chicken-and-egg, cart-before-the-horse conundrum. Yes, eventually the industry will need standards, but can they really be set before the processes are established?
Are you an oldtimer or a newcomer?
It has nothing to do with age, and everything to do with whether you have the ability to embrace new and exciting things, or whether you deem them unworthy of your time.
3D processes and approaches: stepping stones to market adoption
I recently had one of those moments of clarity that comes from asking different people the same questions and fitting all the varied answers together like a puzzle to come up with the big picture. In this case, the questions had to do with the various approaches being developed to...
3D is hot at SEMICON West
Given the building momentum around 3D integration schemes and the attention it's getting as the semiconductor bright spot, it's no surprise that at this year’s SEMICON West, there are more programs focused on 3D integration technology issues, both on and off-site, than last year. In fact, if you want to...
3D companies address critical areas
It’s only Tuesday, and already, it’s been a productive week for 3D news.
Countdown to SEMICON West 2009
With only 2.5 weeks to go (you're all saying, really? it's that close?) until SEMICON West, I can see the activity building around this year's event. I've already talked about the increased focus on 3D this year. One thing I didn't mention yet are the various awards programs that...
