Latest Posts - Page 3
New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs
Apps natively integrated with the Xcelium Logic Simulator enable users to target domain-specific needs for highest verification performance SAN JOSE,...
Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes
SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital and custom/analog design flows have been...
What’s Happening at the IMAPS SiP Conference?
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that customer adoption of the Cadence® Cerebrus™ Intelligent Chip Explorer is accelerating...
ECTC 2022 Member Preview — Stacked and Packed
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components...
2022 IMAPS DPC: Back and Better Than Ever
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS...
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
Congratulations to the Winners of the 2022 3D InCites Awards!
It is my honor to announce the winners of the 2022 3D InCites Awards. With 51 nominees in 11 categories,...
Dr. Anirudh Devgan Honored With 2021 Phil Kaufman Award
Cadence President and CEO Recognized for Making a Significant Impact on the EDA Industry Through Pioneering Technical Contributions and Business...
The World of Logic as We Know It
October is a busy month as conferences go. ARM and Intel each held their virtual developer events focusing on the...
Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence® Tensilica® HiFi 1 DSP, which improves the user experience by...
Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is working with TSMC to accelerate 3D-IC multi-chiplet design innovation....