Blogs Archives - Page 6 of 76

3D In Context View all

AI and VLSI

Jul 16, 2024 · By Dean Freeman · 3D In Context

What do oxide transistors, ferroelectrics, 2-dimensional channel layers, CFETS, Advanced packaging, AI, and tradewinds have in common? They were all topics at the IEEE VLSI Conference in June. The VLSI conference is held every June alternating between Hawaii, and Kyoto. In 2024 there were three and a half days of...

Sustainability is Busting Out all Over!

Jun 19, 2024 · By Dean Freeman · 3D In Context

When prepping for this month’s sustainability blog, the song, June is Busting Out All Over, from Rogers and Hammerstein’s Carousel, kept running through my head; possibly as it’s in May, June, and July, when the majority of companies sustainability reports are released. Once the reports are released, the sustainability experts...

Semiconductor Industry Collaboration is the Key

Jun 09, 2024 · By Dean Freeman · 3D In Context

40 years ago in 1984, the semiconductor industry was in one of its many transitions. The USA had lost its leadership role in memory and companies were starting to transition out of the DRAM business. Logic chips were gaining in importance as the personal computing business was a few years...

Will AI be Powered by Renewables? Maybe, But Not for Long

May 20, 2024 · By Dean Freeman · 3D In Context

Earth Day has passed. Companies’ ESP/social responsibility reports are beginning to appear and they have been commenting on their progress in their Q1 earnings report. The early data in the semiconductor and microelectronics segment looks encouraging. The percentage of renewables in their energy portfolio is increasing. Water conservation and water-positive...

Francoise in 3D View all

SEMICON West 2024: Riding the Generative AI Winds of Change

Jul 15, 2024 · By Francoise von Trapp · Blogs

Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great chaos precipitated by the pandemic, geopolitical tensions, the climate crisis, and the talent shortage, one singular driver is driving unprecedented change: Generative AI. Generative AI was referenced in almost every...

ECTC 2024: Advanced Packaging Engineers to the Rescue!

Jun 01, 2024 · By Francoise von Trapp · Blogs

If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then you must be feeling very important right now; especially if you’re an advanced packaging engineer. Whether you’re improving energy efficiency, increasing yield, delivering innovative process control solutions, designing next-generation advanced...

The Nexus of Innovation for U.S. Semiconductor Manufacturing

May 07, 2024 · By Francoise von Trapp · Blogs

Will Arizona be the nexus of innovation for U.S. semiconductor manufacturing? It certainly looks that way. The speakers and panelists who presented at SEMI’s Arizona Breakfast Forum on May 1, confirmed what those of us who live and work here already know: The sun isn’t the only thing heating up...

IMAPS DPC 2024 Makes Advanced Packaging Fun Again!

Mar 26, 2024 · By Francoise von Trapp · Blogs

At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...

From Different Dimensions View all

Sustainability 101: Employee Action Groups for Sustainability

Jul 10, 2024 · By Julia Freer Goldstein · Blogs

Lofty sustainability goals like becoming carbon neutral by a specific date or committing to science-based targets for greenhouse gas emissions sound good. Making them public can spur progress at your company and with suppliers and customers. However, these goals can also feel overwhelming or too distant to tackle. Employees need...

Generative AI Needs Advanced Packaging Solutions

Jul 07, 2024 · By YES · Blogs

The adoption of Generative AI is growing every day. Apple is the latest to announce the use of Generative AI in its Siri App. With this rapid growth of the use of AI in our day-to-day life, comes the need to train the models behind these tools. This requires a...

June Member News Highlights Semiconductor Design Tools, Collaborations, and More

Jun 26, 2024 · By Avery Gerber · Blogs

This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing chip design and manufacturing. New software tools are boosting design and verification, and our members are driving innovation through key collaborations and contributions. From product development to workforce initiatives that...

Sustainability 101: PFAS-Free Filters

Jun 12, 2024 · By Julia Freer Goldstein · Blogs

Fluoropolymers are excellent materials for filters. Polytetrafluoroethylene (PTFE), the same polymer used in Teflon coatings, is inert, stable, hydrophobic, and durable, making it an ideal filtration media. Except for one potential problem. PTFE is a member of the PFAS (per- and polyfluoroalkyl substances) class. Even though PTFE no longer contains...

Interconnectology 101 View all

An Overview of the Global Semiconductor Secondary Equipment and Parts Market

Jul 01, 2024 · By Jillian Carapella · Blogs

Even though it seems like everything has a computer chip these days, the semiconductor industry was not immune to the destruction of COVID-19. As millions of people geared up to work from home, a global chip shortage emerged. Rapid fluctuations in the automotive market exacerbated this. Because so many people...

Understanding the Role of Inspection and Metrology for AI Packages

Jun 18, 2024 · By Jillian Carapella · Blogs

At this point, we can’t deny it – we’re truly living in the age of AI. But in today’s changing world where ChatGPT generates information faster than ever imagined, one thing is certain: today’s technology-driven society would not be feasible without advanced packaging. To help me write this article, I...

Why Are HBM Manufacturers Choosing Liquid Mold Underfill?

Jun 06, 2024 · By Jillian Carapella · Blogs

As the world demands faster and smarter technologies than ever before, the importance of underfill is gaining traction in the realm of advanced packaging. Underfill is an epoxy that helps fill gaps between a chip and its substrate. It’s important because it works to relieve stress on the chip, thus...

Image of Lam’s Syndion® etch tool. Syndion and Lam’s SABRE® 3D copper electroplating tool are used in the advanced manufacturing of high bandwidth memory by leading memory providers.

Innovative TSV Processing is Critical to Enable the AI Era

May 30, 2024 · By Jillian Carapella · Blogs

With all the data that needs to be processed, stored, accessed, and rewritten for advanced technology applications like artificial intelligence (AI), High Bandwidth Memory (HBM) is the key that drives these innovations forward. To learn more, I spoke with Aaron Fellis, general manager at Lam Research, about advanced packaging breakthroughs...

Packaging IFTLE View all

IFTLE 599: Prismark’s 30-Year Perspective of the Electronics Industry

Jul 17, 2024 · By Phil Garrou · Blogs

Prismark Partners consultants, based in Cold Spring Harbor NY, is having its 30-year anniversary this year. As part of that celebration, Jeff Doubrava of Prismark has taken a look at what has happened in the electronics industry over the past 30 years. First, let’s see what was going on in...

IFTLE 598: NSTC Update

Jul 02, 2024 · By Phil Garrou · Blogs

In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation in the United States. As a public-private consortium, NSTC members will have access to an investment fund, facilities, partners, and additional funding opportunities to research, test, and scale up semiconductor...

IFTLE 597: Samsung Glass Substrates; Samsung SAINT

Jun 24, 2024 · By Phil Garrou · Blogs

Samsung Announced Glass Substrates Effort Samsung Group’s electronics subsidiaries have announced a joint research and development effort between Samsung Electro-Mechanics and the group’s major electronics affiliates, including Samsung Electronics and Samsung Display to accelerate the commercialization of glass substrates to commercialize faster than semiconductor rival Intel in the U.S. Samsung...

IFTLE 596: Advanced Packaging Reshaping the Chip Ecosystem

Jun 17, 2024 · By Phil Garrou · Blogs

The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics chip ecosystem. Let’s take a look at some of the points that they make. Advanced packaging is replacing simple “scaling”, which had been the traditional way to achieve advancements in...