PROPHESEE Joins IRT Nanoelec 3D Integration ProgramOct 14, 2019 · By Sarah-LyleDampoux · Press Releases PROPHESEE Joins IRT Nanoelec 3D Integration Program Will Work with CEA-Leti, STMicroelectronics, Mentor, EVG, and SET to Develop New 3D...
EV Group Joins IRT Nanoelec 3D Integration ProgramFeb 05, 2016 · By Sarah-LyleDampoux · Press Releases ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology,...
SET joins IRT Nanoelec 3D Integration ProgramJan 15, 2016 · By Sarah-LyleDampoux · Press Releases SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders,...
IRT Nanoelec Partners Achieve 3D Chip-stacking Technology and 3DNoC Framework for Digital ProcessingJul 09, 2015 · By Sarah-LyleDampoux · Press Releases GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using...
French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-WaferMar 10, 2015 · By Sarah-LyleDampoux · Press Releases GRENOBLE, France – March 5, 2015 – IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and...