Announcing The Nominees for the 2023 3D InCites Awards
The following companies are being recognized for making a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.
Additionally, the 2023 3D InCites Awards recognize companies that demonstrate best practices in sustainable semiconductor manufacturing, and diversity equity and inclusion (DEI). These companies are candidates for the 3D InCites Sustainability Award and the SemiSister Award for DEI, respectively.
Winners of the Technology Awards are selected by a panel of five judges: four are industry experts and the fifth judge is YOU, the 3D InCites Community, via the online ballot. Winners of the Sustainability and SemiSister Award for DEI will be selected by special committees.
Congratulations to all the companies who were nominated! We’re excited to announce the Winners on March 7, and presenting the awards in person at a ceremony on March 14, 2023, at the IMAPS Device Packaging Conference.
Winners will be selected by a panel of five judges:
- Bob Smith
Executive Director, SEMI Electronic System Design Alliance
- Phil Garrou
Microelectronics Consultants of North CarolinaPaul Franzon, Professor Department of Electrical and Computer Engineering, North Carolina State University
- Beth Keser
President, International Microelectronics and Packaging Society, Director, Package Engineering at Intel
- Steffen Kröhnert
President & Founder ESPAT-Consulting
The fifth judge is YOU, the 3D InCites Community, via the online ballot.
We are accepting nominations through February 14, 2023
- Accepting Applications: October 2-20, 2023
- Finalists Notified: November 27, 2024
- Finalists Announced: January 8, 2024
- Awards Presented: March 14, 2024