3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science
Brewer Science, Inc., an industry leader in advanced packaging materials for semiconductor manufacturing, will present its latest research on the next-generation of 3D packaging materials and thin-wafer processing techniques, at the Electronics and Packaging Technology Conference (EPTC) in Singapore, December 3rd through 6th.
High Cost and Stringent Requirements are Preventing Cu/SiOx Scalability
Brewer Science will collaborate with Industrial Technology Research Institute (ITRI) to address the challenges associated with scaling hybrid bonding in advanced packaging: cost, temperature, and defectivity. The team will co-present a photosensitive polymer material that serves as an organic passivation layer, potentially mitigating challenges that pose the greatest threat to scaling what is currently a copper (Cu) and silicon oxide (SiOx) hybrid bonding process. Attend Brewer Science and ITRI’s joint presentation, Versatile Photosensitive Polymer Applied in Low-Temperature Hybrid Bonding with Nanocrystalline Cu on December 6, 2024 at 9 a.m. in Veranda III to get answer some of our industry’s most pressing questions on this topic, including:
- How can the cleanliness requirements of current Cu/SiOx hybrid bonding processes be reduced?
- How can the bonding process be made more accessible to backend fabs, such as OSATs?
- Is there an alternative to the high-temperature annealing typically required in hybrid bonding?
Temperature Limitations in Temporary Bonding Materials are Limiting Processing Capabilities
Brewer Science will collaborate with EV Group (EVG) and AMS-Osram to address temporary bonding material challenges, such as chemical vapor deposition (CVD) or other high temperature processing steps, that are currently limited by debonding temperatures of 250°C. The team will co-present a high-temperature stable temporary bonding material, BrewerBOND® C1301-50 material, that is able to withstand temperatures up to 420°C, making it compatible with IR LayerRelease™ laser debonding technology (provided by EVG) to expand processing capabilities, integrating high-temperature processes without compromising the device during backside processing. Attend Brewer Science and EVG’s joint presentation High-temperature-stable temporary bond adhesive for IR laser debonding enables new process integration for thin wafers on December 6, 2024 at 10:35 a.m. in Veranda II to get answer some of our industry’s most pressing questions on this topic, including:
- How temporary bonding materials can be improved to withstand high temperature processes?
- Can IR laser debonding successfully work with silicon-based carrier systems?
- How does this development impact CMOS devices?
“Our research into high-temperature-stable temporary bonding materials and IR laser debonding technology represents a significant leap forward for the advanced packaging industry,” states Matt Koch, Business Development Manager at Brewer Science. “By enabling reliable bonding and debonding at temperatures up to 420°C, we’re opening the door to more complex process integrations and expanding the capabilities of silicon-based carrier systems. This development will help fabs overcome existing temperature limitations and meet the growing demands of high-performance device manufacturing.”
For those unable to attend the event, additional information can be obtained by submitting a request at the bottom of our website.
