Archives February 2012 - 3D InCites

The Making of a Real 3D Movie

I usually never miss the Academy Awards, but this year I am in Germany visiting Fraunhofer IZM ASSID  in Dresden for a 3D InCites sponsored site visit, and decided against getting up at 2am to see first hand who won Best Picture. I was invited by M. Juergen Wolf, who manages and coordinates IZM-ASSID (which stands for all silicon system integration Dresden), to come and see what Fraunhofer’s pr... »

SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography Simulation Software

SUSS MicroTec a  supplier of equipment and process solutions for the semiconductor industry and related markets and GenISys GmbH, provider of high-performance software solutions for nano scale fabrication, today announced a cooperation agreement to combine the SUSS MicroTec mask aligner tools with the GenISys simulation software Layout LABTM. Within the cooperation GenISys Layout LABTM has been ... »

Why Bill McClean Says the IC Market Growth Will Be Much Better Over the Next 10 Years

I attended the annual IMAPS local chapter lunch here in Arizona last week and got the low-down on the semiconductor market and forecast from Bill McClean at IC Insights.  Bill does a great job at showing the whole picture – comparing the Worldwide GDP and showing the correlation between it and the worldwide semiconductor market. He’s also good at relating theory to statistics, which helps som... »

Apache Design Releases Fourth-Generation RedHawk for Sub-20 Nanometer Power Sign-off

ANSYS  subsidiary Apache Design, Inc. today introduced RedHawk(TM)-3DX to meet the power, performance and price demands of low-power mobile, high-performance computing, consumer and automotive electronics. This fourth-generation power sign-off solution delivers greater accuracy, capacity and usability for full-chip dynamic power and reliability simulation to manage power consumption and improve ... »

CEA-Leti Introduces LETI-3S (Silicon Specialty Solutions) Concept

Grenoble- based research institute, CEA-Leti, has announced it will  focus on a new collaboration model for a wide range of industry oriented customers from start-ups to manufacturers. The unique, research-oriented, process and metrology tool set will offer: Advanced single step processes to high-end process modules to realize some or the entire product or simply make a proof-of-concept demons... »

Getting down to the Business of 3D ICs

Really, it all boils down to simple economics.  I’m referring to WHY the road to 3D is taking as long as it is to reach commercialization.  We’ve convinced the engineers of the technology benefits. Now it’s time to convince those who hold the purse strings: the management. I had an interesting discussion about this with Herb Reiter upon his return from Tokyo where he moderated a 3D panel ... »