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We are excited to share that we’ve partnered with SEMI’s Market Intelligence team to bring you quarterly semiconductor industry market updates. Each episode will feature one of SEMI’s market analysts, who will discuss different market trends driving specific areas of the market. They’ll also provide some high-level intelligence to help you in your day-to-day business […]
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Fab equipment investment in 2023 is expected to remain strong. Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022 was posted by Shannon Davis on Semiconductor Digest.
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From neon gas to tool components, the industry is creating more resilient supply chains. The post Ways To Address The Materials Crunch appeared first on Semiconductor Engineering.
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Françoise hit Technology Corner at the IEEE Electronic Components Technology Conference 2022, May 31-June 3, interviewing 3D InCites member companies about being back in person, and their perspectives of some of the key industry challenges such as supply chain issues, sustainability; diversity, equity, and inclusion efforts, new technology advancements, and much more. Tanja Braun, Fraunhofer […]
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In Part 1 of ECTC 2022 coverage, Françoise catches up with some of the industry visionaries at key companies in the microelectronics space, as well as 3D technology research institutes to find out what they shared and learned at ECTC 2022. The episode kicks off with a conversation with Marvell’s Kevin O’Buckley who talked about […]
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Engineers are finding ways to effectively thermally dissipate heat from complex modules. The post Keeping IC Packages Cool appeared first on Semiconductor Engineering.
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The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects. Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes. The power, performance, and cost for each unit may be optimized separately.… Read More The post Standardization of Chiplet […]
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Challenges involving reliability, integration and chiplet availability will take time to iron out. The post Who Benefits From Chiplets, And When appeared first on Semiconductor Engineering.
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The semiconductor industry is on a rapid growth trajectory, with a goal of becoming a $1 trillion industry by 2030 – that’s only 8 years away! Getting there will require a tremendous amount of innovation, investment, and risk-taking – all characteristics that define an entrepreneur. But what does it really mean to be an entrepreneur […]
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Key executives from leading semiconductor companies, market analysts, economists and policymakers gather today for insights into the latest electronics industry trends, challenges and opportunities in Brussels, Belgium at the annual Industry Strategy Symposium Europe (ISS Europe) 2022. SEMI ISS Europe Opens With Spotlight on Sustainability, Supply Chain Resilience and Talent was posted by Shannon Davis on […]
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In our continued coverage of the chip shortage and actions being taken around the globe, this episode looks at the raw materials market, and how different aspects of it are impacting the semiconductor supply chain. Françoise speaks with Lewis Black, CEO of Almonty Industries, an international raw materials development company that mines tungsten – which […]
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The devices that handle most of the computing needs of today’s consumers are either smartphones, tablets, or personal computers (PC). In terms of shipped quantity, smartphones take the lion’s share, with more than three times the amount of annual shipments as tablets, laptops, and desktops combined, according to Yole Développement’s market data. In terms of […]
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Intel CEO Pat Gelsinger warns the two–year chip shortage is likely to continue through 2024. The post Intel CEO Expects Chip Shortage to Persist Through 2024 appeared first on EETimes.
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Experiments and mold flow simulation results for a void-free wafer level molded underfill process with High-Density Fan-Out test vehicles using a wafer-level compression molding process. The post Wafer Level Void-Free Molded Underfill For High-Density Fan-out Packages appeared first on Semiconductor Engineering.
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As we all know, events of the last two years that are beyond our control – such as the pandemic, geopolitical issues, trade wars, and the war in Ukraine – have had a significant impact on the semiconductor supply chain, sending us scrambling for workarounds and playing catch-up. What if we had been better prepared […]
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The importance of monitoring and reporting different classes of emissions. The post Reducing Greenhouse Gases In Manufacturing appeared first on Semiconductor Engineering.
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I attended the annual user group meeting called User2User in Santa Clara this year, hosted by Siemens EDA, with 51 presentations by customers in 11 tracks, and keynotes during each lunch hour from semiconductor executives. Joseph Sawicki, Executive VP, IC Segment, at Siemens EDA presented on a Tuesday, along with Prashant Varshney,… Read More The […]
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SEMI Europe’s Laith Altimime joins Françoise for a conversation about how the Ukraine War is impacting Europe in general, and specifically the European semiconductor industry supply chain. Laith explains what SEMI is doing to support the semiconductor supply chain crisis. On a brighter note, they also talk about the outcome of the recent European Chips […]
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Recent products show that even large and complex chiplet structures can be designed reliably and efficiently. The post Chiplets: Current Status appeared first on Semiconductor Engineering.
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What’s changed about ISS since 2020? The attendees were 20% women – and specifically, women in leadership. To celebrate, we gathered some of our SemiSisters for a conversation over breakfast and recorded it as a podcast episode. We talked about lots of things – what it’s like to be a woman in this male-dominated industry, […]
