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Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking. The post Hybrid Bonding Moves Into The Fast Lane appeared first on Semiconductor Engineering.
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Common themes emerge, but so do different ways of looking at a problem, from business opportunity to concern for the environment. The post Distilling The Essence Of Four DAC Keynotes appeared first on Semiconductor Engineering.
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In this episode, we visit 3D InCites member companies on the trade show floor at SEMICON West and the Design Automation Conference to learn about what they are showcasing this year. Dave Kirsch and Paul Lindner of EV Group talk about the latest achievement in die-to-wafer fusion and hybrid bonding, and what it means for […]
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This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place. Françoise von Trapp speaks with Joe Stockunas, the new President of SEMI Americas; Ajit Manocha, SEMI CEO and President; Mousumi Bhat, who heads up SEMI’s […]
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Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an open chiplet ecosystem. Although the initial specification for UCIe was developed by Intel, a consortium was announced in March with Intel, AMD, Arm, Google,… Read More The post OpenFive Joins Universal […]
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SEMI today applauded progress in the United States Senate on a robust package of federal incentives for the semiconductor supply chain and urged its timely passage in Congress. SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval was posted by Shannon Davis on Semiconductor Digest.
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With over 350 FDA–approved medical devices using AI, the technology is enabling portable MRI machines, foolproof ultrasounds, and more The post When We Put AI in Medical Devices, Magic Starts to Happen appeared first on EETimes.
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Why new approaches are required to design complex multi-chip systems. The post Customization, Heterogenous Integration, And Brute Force Verification appeared first on Semiconductor Engineering.
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Françoise von Trapp interviews Thomas Smelker, of Mercury Systems, about what is meant by “Trusted and Secure” microelectronics, and why it is critical to Mercury’s military, aerospace, space, and industrial customers. He then does a deep dive into the geopolitical climate, the “actors” are trying to take away the technological advantage the US and its […]
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Choosing components from a multi-vendor menu holds huge promise for reducing costs and time-to-market, but it’s not as simple as it sounds. The post Security Risks Widen With Commercial Chiplets appeared first on Semiconductor Engineering.
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So far there is little agreement on the best alternative to gasoline engines, but semiconductor technology is required for all of them. The post Which Fuel Will Drive Next-Generation Autos? appeared first on Semiconductor Engineering.
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Supplyframe today announced that it is a Gold-level sponsor of Women in Electronics, a community of progressive women leaders at all stages of their careers dedicated to expanding the opportunities for women in the fast-paced electronics industry. Supplyframe Invests in Women in Electronics was posted by Shannon Davis on Semiconductor Digest.
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ASE’s Mark Gerber, Amkor’s Curtis Zwenger, and Quorvo’s Matthew Poulton talk about 5G Technology Challenges; Synopsys’ Ming Zhen talks about the Era of SysMoore; Start-up competition competitors give mini-pitches. While the rollout of 5G is underway, there are remaining technology challenges that must be solved before we can really experience the full benefits of 5G. […]
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CBRS is about to start its time in the sun with 5G. The post CBRS and 5G: Boosting the Data Rates? appeared first on EETimes.
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What’s missing from tool chains and methodologies as chiplets and advanced packaging become more popular. The post EDA Gaps At The Leading Edge appeared first on Semiconductor Engineering.
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Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks. This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote […]
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When the problem statement changes, it sometimes pays to use a completely different approach. The post A New Breed Of EDA Required appeared first on Semiconductor Engineering.
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We are excited to share that we’ve partnered with SEMI’s Market Intelligence team to bring you quarterly semiconductor industry market updates. Each episode will feature one of SEMI’s market analysts, who will discuss different market trends driving specific areas of the market. They’ll also provide some high-level intelligence to help you in your day-to-day business […]
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Fab equipment investment in 2023 is expected to remain strong. Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022 was posted by Shannon Davis on Semiconductor Digest.
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From neon gas to tool components, the industry is creating more resilient supply chains. The post Ways To Address The Materials Crunch appeared first on Semiconductor Engineering.
