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In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry. Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and […]
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SEMI today announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States was posted by Shannon Davis on […]
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Tracking innovation in advanced package design. The post NHanced Project Puts U.S. on Advanced-Packaging Map appeared first on EE Times.
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The U.S. may make significant investments in Vietnam to boost its semiconductor sector.
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More than Moore is off to a good start, but the next steps are a lot more difficult. The post Why There Are Still No Commercial 3D-ICs appeared first on Semiconductor Engineering.
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The compound semiconductor substrate market is growing at a compound annual growth rate (CAGR) of 17% to $3.3bn in 2029, according to the report ‘Status of Compound Semiconductors Industry 2024’ by market analyst firm Yole Group…
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At SEMI ISS, Paul Triolo, Albright Stonebridge Group (ASG) delivered a presentation on the geopolitical headwinds impacting the semiconductor industry in 2024. He explains challenges of industrial policies, export controls, and supply chain perturbations. Triolo is Senior Vice President for China and Technology Policy Lead at ASG, where he is also an Associate Partner. He […]
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For the first few episodes of Season 4 of the 3D InCites Podcast, Françoise von Trapp headed to the SEMI Industry Strategy Symposium, (ISS) where semiconductor industry executives gather to gain and share insight on where the semiconductor industry is headed, and how they can work together to get there. Economic trends, industry markets, and […]
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Tenstorrent and Alphawave foresee a day when they may overcome the likes of Qualcomm. The post Chiplet Makers Expect to Disrupt Incumbents appeared first on EE Times.
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Many young people don’t know they can apply their field of study to chipmaking work. The post Students of Many Stripes Can Aspire to Chip-Building Careers appeared first on EE Times.
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Françoise von Trapp talks to SEMI President and CEO Ajit Manocha, about the semiconductor industry’s journey on the path to becoming a $1 Trillion and what SEMI is doing to address the headwinds that could prevent that from happening. The semiconductor industry is growing at an amazing rate as demand for computer chips increases in […]
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Problems need to be solved before this technology goes mainstream, but the benefits are significant. The post Glass Substrates Gain Foothold In Advanced Packages appeared first on Semiconductor Engineering.
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Investments boom as countries and companies vie for supply chain security and technology leadership. The post Money Pours Into New Fabs And Facilities appeared first on Semiconductor Engineering.
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If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to […]
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Once again, Cassandra Melvin, SEMI Europe, takes over the mike from Françoise von Trapp to lead a panel discussion on the Future of Work in the semiconductor industry. We join the panel discussion in progress, as it was part of a session on the Future of Work that took place in Munich during SEMICON Europa. […]
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The Arizona Commerce Authority (ACA) has announced a $17.5m investment in Arizona State University (ASU) to expand Arizona’s advanced semiconductor manufacturing capabilities. The expansion will enhance Arizona’s fan-out wafer-level packaging R&D and workforce training capabilities and drive the creation of a gallium nitride (GaN) manufacturing and research ecosystem in the state to enable technology of […]
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Who wins, who loses, and where are the big challenges for multi-vendor heterogeneous integration. The post Proprietary Vs. Commercial Chiplets appeared first on Semiconductor Engineering.
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Innovation in Europe’s semiconductor industry shows growth can remain consistent with a net zero roadmap. The post Shaping A Sustainable $1 Trillion Era appeared first on Semiconductor Engineering.
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In this episode, which was recorded live at SEMICON Europa 2023, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI. She led the session during the Fab Manager Forum on How To Cultivate the Workforce of Tomorrow and moderated a panel discussion on Achieving EU Ambitions Through […]
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Finding defects in stacked die is a daunting challenge. Equipment, processes, and methodologies all need modifications, and that’s just for starters. The post Closing The Test And Metrology Gap In 3D-IC Packages appeared first on Semiconductor Engineering.
