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Advanced Packaging Industry: A Wonderful World

The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on integrated circuit (IC) packaging to extend the benefits of the More-than-Moore era. Thus, the advanced packaging industry has entered its most successful period, boosted by widespread needs for better integration; the slowdown of Moore’s law; and me... »

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

EVG continues win streak with 17th consecutive year listed among “THE BEST” suppliers in survey results; frequently cited by customers as best at partnering and recommended supplier EV Group (EVG) today announced that it has once again been voted by customers as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of 2019’s  BEST Suppliers of Fab Equipment in the 2019 V... »

EV Group’s MLE Technology Revolutionizes Lithography

EV Group’s MLE Technology Revolutionizes Lithography

EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications. The world’s first highly scalable maskless lithography technology for high-volume manufacturing (HVM), MLE combines... »

Analysis Highlights Impact of Trade Friction on Electronics Industry

Analysis Highlights Impact of Trade Friction on Electronics Industry

The impact of the ban on selling components to Huawei combined with generally lower shipments for PCs and mobile phones is having an impact on the electronics industry this year. TechSearch International’s latest analysis examines the impact in terms of the OSAT financials and unit shipments. A market forecast for ball grid arrays (BGAs) and chip scale packages (CSPs) in units by package constru... »

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate HQ in Austria
EVG Cleanroom V - 3D Rendering EV Group Cleanroom V - Construction Site

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate HQ in Austria

EV Group (EVG) today announced that it has begun construction on another extensive capacity expansion building project at its corporate headquarters in St. Florian am Inn, Austria. With an investment of 30 million Euros, the new Cleanroom V building will create additional capacity for product and process development, equipment demonstrations for existing and potential customers, feasibility studie... »

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