Richard Otte

Richard (Dick) Otte, president and CEO of Promex Industries and its QP Technologies division, has long played a role in the evolution of heterogeneous integration (HI). For 20+ years, he applied his electronics engineering expertise – he holds BSEE and MSEE degrees from MIT, as well as a Harvard MBA – to such HI projects as thin-film MCMs at Advanced Packaging Systems, the Raychem-Corning Glass JV, and early optical applications. He champions HI for medical and biotech products, is frequently tapped for HI commentary, and advocates building a strong foundation in chiplets and other emerging packaging technologies. Dick chairs the Integrated Photonics Systems Roadmap International's Assembly Technical Working Group and the Technical Working Group for the iNemi Roadmap Optoelectronics Chapter. He has also helped shape the test requirements for the HI Roadmap, and has further contributed to HI and packaging developments through his memberships in IEEE, IPC, Optica, SMTA, IPSR and MEPTEC.