Bill Chen, Chair of the HIR and Fellow at ASE

2020 Edition. In Engineer of the Year

Bill Chen, Chair of the HIR and Fellow at ASE, is being nominated for his tireless efforts to bring the Heterogeneous Integration Roadmap (HIR) into reality. He was instrumental throughout the process, and his name is synonymous with this initiative. The HIR initiative has been a significant undertaking for the entire Advanced Packaging and 3D community over the past few years, and its publication in 2019 is a great achievement. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines.