Samsung Foundry certified ANSYS multiphysics simulation solutions for its latest multi-die integration™ (MDI) advanced two and a half dimensional/three-dimensional integrated circuit (2.5D/3D-IC) packaging technology. The certification empowers mutual customers to achieve higher performance and lower power within a smaller form factor when designing 2.5/3D-ICs for AI, 5G, automotive, networking and high-performance computing (HPC) applications.

System-in-Package designs are highly complex with multiple dies integrated on an interposer in a 2.5D/3D packaging configuration. Samsung Foundry certifies ANSYS® Icepak® and ANSYS® RedHawk™ family of solutions for power, signal and thermal integrity and reliability analyses. The certification allows for detailed modeling of silicon interposer, through silicon vias, microbumps, high-bandwidth memory, high-speed interfaces and different dies, which is critical for accurately simulating power, signal thermal integrity effects.