Brewer Science (BSI) has been supplying advanced materials to the semiconductor market for over 37 years. For the last 13 years, BSI has been supplying temporary bonding/debonding materials that cover a wide variety of release methods, including chemical, thermal slide, mechanical, and laser release. These products provide the user with increased throughput, performance, and yield rates. BSI's wafer-level packaging materials enable device manufacturers to reduce the form factors and increase the efficiency of their products and processes. Brewer Science is committed to solving the biggest challenges in the compound semiconductor, 2.5D, 3D IC, and fan-out packaging markets.